Events
Innovation enables organizations to open new avenues of product differentiation by customizing products. In today’s rapidly changing business environment, engineers must innovate quickly to incorporate new features while reducing development costs and delivering new products to the market before the competition. Simulation plays a key role in helping engineers drive innovation, enabling complete virtual prototypes of complex systems to be validated across all physics and engineering disciplines.
Join us as we return to Ottawa for our 4th Annual ANSYS Innovation Conference on May 8, 2019! This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.
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What You Will Learn
- Experience new simulation capabilities that provide unprecedented design insight as they speed your time to market
- Incorporate various productivity enhancement tools and techniques into your engineering department’s workflow
- Gain insights into 5G system development with physics-based simulation and cover critical design issues, such as antenna performance, semiconductor reliability, and thermal integrity
- Identify signal integrity issues early in the design cycle for electronics IC packages, PCBs, connectors and other complex interconnects
- Modify antenna design, predict antenna efficiency and the overall thermal and EM performance of the product based on electromagnetic and thermal coupling solutions
Fields-CQAM Public Lectures: Ali Ghodsi, University of Waterloo
What is missing from common practice in machine learning?
AI, and machine learning in particular, is enjoying its golden age. Machine learning has changed the face of the world over the past two decades but we are still a long way from achieving a general artificial intelligence. In this talk, I will discuss a couple of elements that I believe are missing from common practice in machine learning, including incorporating causality and creating a new framework for unsupervised learning.
Biography
Ali Ghodsi is a Professor in the Department of Statistics and Actuarial Science at the University of Waterloo. His research involves statistical machine-learning methods. Ghodsi’s research spans a variety of areas in computational statistics. He studies theoretical frameworks and develops new machine learning algorithms for analyzing large-scale data sets, with applications to bioinformatics, data mining, pattern recognition, robotics, computer vision, and sequential decision making.
DATE:
THURSDAY, JUNE 20TH, 2019.
PRESENTATION
6:00 PM – 7:00 PM.
NETWORKING
7:00 PM – 8:00 PM.
LOCATION
HEALTH SCIENCE BUILDING, RM. 1301 (LOCATED ON THE GROUND FLOOR), CARLETON UNIVERSITY.
FREE ADMISSION FOR THIS PUBLIC LECTURE.
PLEASE REGISTERÂ HERE.
8:30 am – 9:00 am | Registration | ||
---|---|---|---|
9:00 am – 9:15 am | Opening Remarks | Rafik Goubran | Carleton University |
9:15 am – 10:00 am | Keynote Presentation:
Data Mining and Machine Learning for Authorship and Malware Analyses |
Benjamin C. M. Fung Biography |
McGill University |
10:00 am – 10:30 am | Break | ||
10:30 am – 11:45 am | Cybersecurity: Top 5 class imbalance ML challenges and data sets Abstract |
Stephan Jou Biography |
Interset |
Class Imbalance in Fraud Detection Abstract |
Robin Grosset Biography |
MindBridge Analytics Inc. | |
Handling class imbalance in natural language processing Abstract |
Isuru Gunasekara Biography |
IMRSV Data Labs | |
11:45 am – 12:45 pm | Lunch | ||
12:30 pm – 2:10 pm | Adaptive learning with class imbalanced streams Abstract |
Herna L. Viktor Biography |
University of Ottawa |
Radar-based fall monitoring using deep learning Abstract |
Hamidreza Sadreazami Biography |
McGill University | |
Privacy-preserving data augmentation in medical text analysis Abstract |
Isar Nejadgholi Biography |
National Research Council | |
Failure modelling of a propulsion subsystem: unsupervised and semi-supervised approaches to anomaly detection Abstract |
Julio J. Valdés Biography |
National Research Council | |
2:10 pm – 2:25 pm | Break | ||
2:25 pm – 3:40 pm | TBD | Reddy Nellipudi | DB Schenker |
AuditMap.ai: Hierarchical Sentence Classification in Unstructured Audit Reports Abstract |
Daniel Shapiro Biography |
Lemay.ai | |
Deep Learning techniques for unsupervised anomaly detection Abstract |
Dušan Sovilj Biography |
RANK Software Inc. | |
3:40 pm – 3:50 pm | Closing Remarks |
Speaker 1: Hisham Abed, P.Eng., Ericsson
Topic:Â Power Integrity – Best design practices
Speaker 2: Dr. Ihsan Erdin, Celestica
Topic:Â Power Integrity Optimization amidst MLCC shortage
Parking:Â Free
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC and CPMT society members. Seating is limited. E-mail reservation is required.
Pizza and soft drinks will be served.
Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa
EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632
Directions:Â Â Â www.fidus.com
IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:
Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.
Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632
Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.
Speaker Bio:
Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.
Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.