Events

Jun
21
Fri
FIELDS CENTRE OF QUANTITATIVE MODELLING AND ANALYSIS: WORKSHOP ON Machine Learning in the Presence of Class Imbalance @ Residence Commons, Carleton University
Jun 21 @ 08:30 – 16:30
FIELDS CENTRE OF QUANTITATIVE MODELLING AND ANALYSIS: WORKSHOP ON Machine Learning in the Presence of Class Imbalance @ Residence Commons, Carleton University | Ottawa | Ontario | Canada

 

8:30 am – 9:00 am Registration
9:00 am – 9:15 am Opening Remarks Rafik Goubran Carleton University
9:15 am – 10:00 am Keynote Presentation:

Data Mining and Machine Learning for Authorship and Malware Analyses
Abstract

Benjamin C. M. Fung
Biography
McGill University
10:00 am – 10:30 am Break
10:30 am – 11:45 am Cybersecurity: Top 5 class imbalance ML challenges and data sets
Abstract
Stephan Jou
Biography
Interset
Class Imbalance in Fraud Detection
Abstract
Robin Grosset
Biography
MindBridge Analytics Inc.
Handling class imbalance in natural language processing
Abstract
Isuru Gunasekara
Biography
IMRSV Data Labs
11:45 am – 12:45 pm Lunch
12:30 pm – 2:10 pm Adaptive learning with class imbalanced streams
Abstract
Herna L. Viktor
Biography
University of Ottawa
Radar-based fall monitoring using deep learning
Abstract
Hamidreza Sadreazami
Biography
McGill University
Privacy-preserving data augmentation in medical text analysis
Abstract
Isar Nejadgholi
Biography
National Research Council
Failure modelling of a propulsion subsystem: unsupervised and semi-supervised approaches to anomaly detection
Abstract
Julio J. Valdés
Biography
National Research Council
2:10 pm – 2:25 pm Break
2:25 pm – 3:40 pm TBD Reddy Nellipudi DB Schenker
AuditMap.ai: Hierarchical Sentence Classification in Unstructured Audit Reports
Abstract
Daniel Shapiro
Biography
Lemay.ai
Deep Learning techniques for unsupervised anomaly detection
Abstract
Dušan Sovilj
Biography
RANK Software Inc.
3:40 pm – 3:50 pm Closing Remarks

 

Jul
17
Wed
An Evening with Power Integrity Experts @ Fidus Systems, Ottawa
Jul 17 @ 17:00 – 19:30

Speaker 1: Hisham Abed, P.Eng., Ericsson

Topic: Power Integrity – Best design practices

Speaker 2: Dr. Ihsan Erdin, Celestica

Topic: Power Integrity Optimization amidst MLCC shortage

Parking: Free

Registration:  Free, and is on a first to reply basis. Preference given to IEEE EMC and CPMT society members. Seating is limited. E-mail reservation is required.

Pizza and soft drinks will be served.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa
EMC chapter

Syed.Bokhari@fidus.com,

Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

 

Directions:    www.fidus.com

Nov
24
Sun
Modern Day Applications of Power Electronics – Who Can Benefit?
Nov 24 @ 00:46 – 01:46
Modern Day Applications of Power Electronics – Who Can Benefit?

AbstractApplication of power electronics is widespread in everyday
life. Some applications are considered as “nice to have it;” in other cases,
they are essential. This presentation discusses a wide variety of daily-used
applications around the world. Also covered is an advanced topic, such as SMART
Controller that today’s grid requires for voltage regulation, power factor
regulation, unbalance voltage/current regulation, harmonic elimination and so
on. A SMART Controller that is based on functional requirements and
cost-effective solutions is derived from utilizing the best features of all the
technical concepts that are developed until now. Final year students of
electrical engineering undergraduate curriculum, post graduate students,
researchers, academicians and utility engineers will benefit from attending
this course. The participants will hear from an expert who actually designed
and commissioned a few utility-grade SMART controllers since their inception in
the 1990s.

 

Speaker’s
Bio

Kalyan Sen, a
Fulbright Scholar, is the Chief Technology Officer of Sen Engineering
Solutions, Inc. (
www.sentransformer.com) that specializes in
developing SMART power flow controllers—a functional requirements-based and
cost-effective solution. He
received
BEE,
MSEE, and PhD degrees, all in Electrical Engineering, from Jadavpur University,
India, Tuskegee University, USA, and Worcester Polytechnic Institute, USA,
respectively. He also received an MBA from Robert Morris University, USA.

 

Dr.
Sen spent more than 30 years in academia and industry and became a Westinghouse
Fellow Engineer. He was a key member of the Flexible Alternating Current
Transmission Systems (FACTS) development team at the Westinghouse Science &
Technology Center in Pittsburgh. He contributed in all aspects (conception,
simulation, design, and commissioning) of FACTS projects at Westinghouse. He
conceived some of the basic concepts in FACTS technology. He has authored or
coauthored more than 25 peer-reviewed publications, 8 issued patents, a book
and 4 book chapters in the areas of FACTS and power electronics. He is the
coauthor of the book titled, Introduction
to FACTS Controllers: Theory, Modeling, and Applications
, IEEE Press and
John Wiley & Sons, Inc. 2009, which is also published in Chinese and Indian
paperback editions. He is the co-inventor of Sen Transformer.

Sep
2
Wed
Characterization and Modeling of GaN HEMT Trapping Effects for Microwave Circuit Design
Sep 2 @ 11:00 – 12:00

 

IEEE Ottawa Section: MTT-S / AP-S Chapter presents:

Title: Characterization and Modeling of GaN HEMT Trapping Effects for Microwave Circuit Design

Date: September 2nd, 2020

Time: 11 AM (ET)

Register at: https://events.vtools.ieee.org/m/238482

This talk will review some recent advancements achieved on the characterization and modelling of the trapping effects felt in GaN HEMT transistors, and their impact on microwave circuit design. Because of their nowadays importance, a particular attention will be payed to applications on high power amplifiers for mobile wireless infrastructure and pulsed radar applications.

For that, the talk will start by recollecting the most common model formulations adopted for the various levels of RF engineering, from the device level (physics) to the transistor (circuit) and amplifier (system) level. Starting by the Shockley-Read-Hall capture and emission processes we will be able to understand one of the fundamental signatures of trapping effects, the significantly different charge and discharging time constants, and its impact on power amplifier nonlinear distortion behavior. Then, some widely adopted approaches of the channel current transients’ characterization are addressed and the talk concludes by presenting some illustrative cases of application to RF high power amplifiers.

Speaker: Jose C. Pedro

José C. Pedro received the Diploma, Ph.D., and Habilitation degrees in electronics and telecommunications engineering from the Universidade de Aveiro, Aveiro, Portugal, in 1985, 1993, and 2002, respectively.

He is currently a Full Professor with the Universidade de Aveiro and head of the Aveiro site of the Instituto de Telecomunicações. He has authored 2 books and authored or co-authored more than 200 papers in international journals and symposia. His current research interests include active device modelling and the analysis and design of various nonlinear microwave circuits.

Dr. Pedro was a recipient of various prizes including the 1993 Marconi Young Scientist Award, the 2000 Institution of Electrical Engineers Measurement Prize, the 2015 EuMC Best Paper Microwave Prize, and the Microwave Distinguished Educator Award. He has served the scientific community as a Reviewer and an Editor for several conferences and journals, namely, the IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, for which he was the Editor-in-Chief.

Sep
16
Wed
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Sep 16 @ 17:00 – 18:00
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication                Applications

IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:

Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.

Speaker Bio:

Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.

Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.

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