4th IEEE International Workshop on High-Performance Chip, Package and Systems
27 July, 2015
Date: 11th Aug. 2015
Time: 8am – 3pm
Location:Â 2228 River Building, Carleton university, Ottawa, Canada
Parking: As per Carleton University Parking Rules
Registration: Required
Organizer & Contact info:Â Ram Achar, achar@ieee.org
Website URL:Â www.hpcps.org
Speaker(s) :
This year’s program features 5 eminent researchers and leaders in the area, including, Keynote Speeches, Invited Talks and Distinguished Lectures from:
Prof. Subramanian Iyer: Distinguished Chancellor’s Professor, Dept. of EE, UCLA, Los Angeles
Dr. Peter Thoma:Â Managing Director, R&D, CST Gmbh, Damstadt, Germany
Prof. John Long: Professor, Dept. of ECE, University of Waterloo, Dept. of ECE, Waterloo, ON, Canada
Prof. Ricardo Reis:Â Professor , UFRGS, Porto Alegre, Brazil
Abstract:
HPCPS is focused on the emerging high-performance electronic chip, packages and systems. Major theme of the workshop is focused on the co-design, modeling and analysis of the mixed-domain issues arising due to the high-speed, high-density and low-power requirements that are demanded from today’s chip, interconnect, package and systems. Particular emphasis is also placed on signal and power integrity and electromagnetic compatibility in modern designs. Emerging techniques and methodologies for mixed-domain integration of diverse modules such as novel interconnects, optical components, RF devices and MEMS with electronic chips and packages are also considered.