Events

​Dear Ottawa Section members,

the COVID-19 pandemic has reached a level of urgency that needs an “all hands on deck” approach..If you are still waiting to play a role by contributing your academic, professional or personal skills to find technology-based solutions: please join us on a web call to organise a response:

Organiser: IEEE-Ottawa SIG on Humanitarian Technology
Date: Friday April 10

Time: 16h30

URL: Google Meet invitation

       https://meet.google.com/wep-xofb-uzo?authuser=1&hs=122

Tentative agenda:

(5min) Introductions

(15min) Sharing of IEEE-specific COVID-19 resources

(25min) Roundtable of local resources

(15min) Roundtable of known needs

(* min) Open discussion & wrap-up

Please RSVP by emailing: alfredo.herrera@ieee.org : this will enable us to prepare the agenda and round table with a number of participants in mind.

​Dear Ottawa Section members,

​​the COVID-19 pandemic has reached a level of urgency that needs an “all hands on deck” approach​. If you are still ​waiting to play a role by contributing your academic, professional or personal skills to find technology-based solutions: please join us on a web call to organise ​a response​:

Organiser: IEEE-Ottawa SIG on Humanitarian Technology

Date:         Friday April 10

Time: 16h30

URL: Google Meet invitation

​       https://meet.google.com/wep-xofb-uzo?authuser=1&hs=122​

Tentative agenda:

1. (5min) Introductions
2. (15min) Sharing of IEEE-specific COVID-19 resources
3. (25min) Roundtable of local resources
4. (15min) Roundtable of known needs
5. (* min) Open discussion & wrap-up

Please RSVP by emailing: alfredo.herrera@ieee.org​ :​ this will enable us to prepare the agenda and round table with a number of participants in mind.

IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:

Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.

Speaker Bio:

Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.

Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.

Date and Place: The event will be held online on September 26th and 27th, 2020.

“Every accomplishment starts with the decision to try” ~ John F. Kennedy

What?
New to Hackathons? Are you also interested in participating in IEEEXtreme 14.0? IEEE WIE Ottawa presents the first ever Mock Hackathon in Ottawa! Win Exciting Prizes and get experience with us. No need to think of an idea! The questions will be given to you. Our mentors will further help you to get a head start in your hackathon journey! This is a practice event just for you! Learn more about IEEEXtreme here-> https://ieeextreme.org/

When?
September 26th and 27th, 2020

Where?
The event is fully online including the mentorship*.

Agenda
September 26th, 2020
01:00 PM The opening ceremony

02:00 PM Commencement of Hackathon

05:00 PM Final Submission

September 27th, 2020
01:00 PM Results declaration webinar

01:30 PM Prize announcement

02:00 PM The closing ceremony

For More Details Visit: https://wie.ieeeottawa.ca/hack613-the-ottawa-hackathon/

Online Talk: From bees to Drones: Exploring bio-inspired machine vision applications for precision agriculture

Bees are used as vectors for pollination and transport of agricultural chemicals in outdoor agriculture and greenhouses. However, in certain situations the use of natural pollinators is problematic. Small unmanned aerial vehicles (UAVs) could serve as an alternate pollination vector in such situations and perform other functions. A step towards the deployment of such a tool is to bring the ability to locate, classify, and analyze flowers aboard a drone.

More info and registration: https://wie.ieeeottawa.ca/event/from-bees-to-drones-exploring-bio-inspired-machine-vision-applications-for-precision-agriculture/.

A presentation by IEEE WIE Ottawa.