Events

The role of Internet and Communication Technology (ICT) in
bringing about a revolution in almost all aspects of human life needs no
introduction. It is indeed a well-known fact that the transmission of
information at a rapid pace has transformed all spheres of human life such as
education, health, and economy to name a few. In addition, with the advent in
Electronics and Photonics Technology (EPT), we have observed sustained growth
and expansion in computation and display technology. From user demography
perspective, urbanized population are the major beneficiary of such advances.
Therefore, the benefits of ICT and EPT are yet to be experienced by almost 4
billion people in the world who are still “unconnected or under-connected” and
suffer as such from the “digital divide,” a term coined in order to emphasize
the lack of ICT infrastructure in many parts of the world.

Major challenges for widespread adoption of ICT and EPT in
these areas are related to cost, lack of power supply, and complexities
associated with learning and usage. However, if we can categorically overcome
these challenges, then these technologies can be used for food, water, shelter,
energy, environment, education, healthcare, and security. In addition, the
wide-spread availability of these technologies, will lead to smart suburbs,
smart towns, smart villages, etc., without the need to necessarily live in
smart cities. This would reverse the trend and allow a more sustainable world
with a more balanced distribution of the population density. In this context,
this talk will present recently proposed solutions to provide high speed
connectivity in rural areas along progress in affordable electronics to serve
and contribute to the development of far-flung regions.

In particular, new solutions for both: (i) integrated
satellite-airborne-ground networks providing global coverage and connectivity
and (ii) terrestrial mesh/multi-hop directive networks connecting underserved
areas will be discussed.

Moreover, some examples of democratized wearable
electronics using Do-It-Yourself (DIY) assembly of paper along Android DIY
applications capturing and displaying vital health signs over connected
smartphones for real-time diagnosis will be presented.

Young Professionals Reception

During the 7th Annual IEEE International Conference on Wireless for Space and Extreme Environments (WISEE 2019)

Wednesday, October 16th from 6:00 PM – 8:00 PM

Sidedoor Restaurant

18b York St, Ottawa, ON K1N 5T5

IEEE Ottawa Young Professionals (YPs) and IEEE WiSEE’2019 Organizing Committee invite all YPs in Ottawa and those attending the 2019 IEEE WiSEE Conference to join the Young Professionals Reception on Wednesday, October 16th, 2019 from 6:00 – 8:00 PM taking place at Sidedoor restaurant at 18b York St, Ottawa, K1N 5T5. Come ready to meet WiSEE Keynote Speakers, Industry intellects, and other Young Professionals, and learn about the different opportunities available through the IEEE and the Young Professionals Program.

The IEEE Young Professionals Program is aimed at supporting IEEE members at an early stage in their career, up to 15 years after their first degree, by helping them evaluate their career goals, polish their professional image, and create building blocks of a lifelong and diverse professional network.

Ottawa Life Member Affinity Group presents: Ottawa L5, the first integrated Connected & Autonomous Vehicle (CAV) test environment in North America.

The Ottawa L5 private test track is a 1,866 acre, fenced and gated private facility with 16 kilometres of paved roads. The largest secure test facility for CAVs in Canada, the Ottawa L5 private test track creates an ideal proving ground for the safe and productive pre-commercial development, testing, validation and demonstration of CAV technologies. The Ottawa L5 testing facilities are equipped with GPS (RTK), dedicated short range communications (DSRC), Wi-Fi, 4G/LTE and 5G telecommunications and networking infrastructure, making it the first integrated CAV test environment of its kind in North America. Find more information at: https://www.investottawa.ca/ottawal5

Tour will last about an hour involving a walk around the site and a group discussion of various technical aspects of the L5 facility. An additional treat is the possibility of an autonomous shuttle ride at the site for some attendees.

Please register in advance with wolfram.lunscher@ieee.org by Friday October 11. Priority will be given to Life members. All members and family are welcome. There is an online liability waiver to be signed. The link will be provided to registrants.

IEEE YP Ottawa Section: Introduction to Amateur Radio Certification

Introduction to Amateur Radio Certification

Presenters: Mike Kennedy and Anis Ben Arfi

This workshop covers the basics of Amateur Radio including:

• How to obtain your license
• Demonstrations
• Hands on!
• Ready to get on the air?

Date: Wednesday, November 27th, 2019 (5:00 – 7:00 PM)

Location: Carleton University, Tory Building Room: 230!

Snacks and refreshments provided!

For more information, visit the following:

https://events.vtools.ieee.org/m/210526
https://www.facebook.com/events/3009020362459225/
https://twitter.com/IEEEYPOttawa/status/1195910737136431106?s=20
https://site.ieee.org/ottawa-yp/event/workshop-introduction-to-amateur-radio-certification/

Presented by IEEE MTT-S Distinguished Microwave Lecturer (DML) Talks:

Transceiver Architectures for Beyond-5G: Challenges and R&D Opportunities, co-organized with SSC-S

By
Dr. Payam Heydari
University of California, Irvine

Date: Thursday, May 14 , 2020

Time: 12:00 PM – 1 PM

Abstract:

The ongoing super-linear growth of world’s population coupled with the worldwide access to internet and the general public’s tendency to use more bandwidth-intensive applications fuel the urgency to enhance wireless infrastructures so as to meet these demands. Consequently, the wireless R&D is headed towards the inception of “Beyond-5G” (e.g., 6G) technology.  This webinar provides a comprehensive overview of challenges and opportunities in designing beyond-5G transceiver architectures capable of achieving high data rates above and beyond 20 Gbps. 

                                                                 Speaker Bio:

Payam Heydari received his Ph.D. degree from the University of Southern California in 2001. He is currently a Full Professor of Electrical Engineering at the University of California, Irvine. Dr. Heydari’s research covers the design of terahertz/millimeter-wave/RF and analog integrated circuits. He is the (co)-author of two books, one book chapter, and more than 150 journal and conference papers. 

Dr. Heydari is an AdCom member of the IEEE Solid-State Circuits Society. Dr. Heydari currently serves an Associate Editor for the IEEE Journal of Solid-State Circuits and the IEEE Solid-State Circuits Letters. He was a member of the Technical Program Committee of the International Solid-State Circuits Conference (ISSCC). Dr. Heydari is an IEEE Fellow for contributions to silicon-based millimeter-wave integrated circuits and systems.

 

                Event is free, but space is limited.  All participants must register in advance. For                                                  Registration: please use the following link