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Innovation enables organizations to open new avenues of product differentiation by customizing products. In today’s rapidly changing business environment, engineers must innovate quickly to incorporate new features while reducing development costs and delivering new products to the market before the competition. Simulation plays a key role in helping engineers drive innovation, enabling complete virtual prototypes of complex systems to be validated across all physics and engineering disciplines.
Join us as we return to Ottawa for our 4th Annual ANSYS Innovation Conference on May 8, 2019! This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.
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What You Will Learn
- Experience new simulation capabilities that provide unprecedented design insight as they speed your time to market
- Incorporate various productivity enhancement tools and techniques into your engineering department’s workflow
- Gain insights into 5G system development with physics-based simulation and cover critical design issues, such as antenna performance, semiconductor reliability, and thermal integrity
- Identify signal integrity issues early in the design cycle for electronics IC packages, PCBs, connectors and other complex interconnects
- Modify antenna design, predict antenna efficiency and the overall thermal and EM performance of the product based on electromagnetic and thermal coupling solutions
The role of Internet and Communication Technology (ICT) in
bringing about a revolution in almost all aspects of human life needs no
introduction. It is indeed a well-known fact that the transmission of
information at a rapid pace has transformed all spheres of human life such as
education, health, and economy to name a few. In addition, with the advent in
Electronics and Photonics Technology (EPT), we have observed sustained growth
and expansion in computation and display technology. From user demography
perspective, urbanized population are the major beneficiary of such advances.
Therefore, the benefits of ICT and EPT are yet to be experienced by almost 4
billion people in the world who are still “unconnected or under-connected†and
suffer as such from the “digital divide,†a term coined in order to emphasize
the lack of ICT infrastructure in many parts of the world.
Major challenges for widespread adoption of ICT and EPT in
these areas are related to cost, lack of power supply, and complexities
associated with learning and usage. However, if we can categorically overcome
these challenges, then these technologies can be used for food, water, shelter,
energy, environment, education, healthcare, and security. In addition, the
wide-spread availability of these technologies, will lead to smart suburbs,
smart towns, smart villages, etc., without the need to necessarily live in
smart cities. This would reverse the trend and allow a more sustainable world
with a more balanced distribution of the population density. In this context,
this talk will present recently proposed solutions to provide high speed
connectivity in rural areas along progress in affordable electronics to serve
and contribute to the development of far-flung regions.
In particular, new solutions for both: (i) integrated
satellite-airborne-ground networks providing global coverage and connectivity
and (ii) terrestrial mesh/multi-hop directive networks connecting underserved
areas will be discussed.
Moreover, some examples of democratized wearable
electronics using Do-It-Yourself (DIY) assembly of paper along Android DIY
applications capturing and displaying vital health signs over connected
smartphones for real-time diagnosis will be presented.
IEEE Ottawa Section: MTT-S / AP-S Chapter presents:
Title: Characterization and Modeling of GaN HEMT Trapping Effects for Microwave Circuit Design
Date: September 2nd, 2020
Time: 11 AM (ET)
Register at: https://events.vtools.ieee.org/m/238482
This talk will review some recent advancements achieved on the characterization and modelling of the trapping effects felt in GaN HEMT transistors, and their impact on microwave circuit design. Because of their nowadays importance, a particular attention will be payed to applications on high power amplifiers for mobile wireless infrastructure and pulsed radar applications.
For that, the talk will start by recollecting the most common model formulations adopted for the various levels of RF engineering, from the device level (physics) to the transistor (circuit) and amplifier (system) level. Starting by the Shockley-Read-Hall capture and emission processes we will be able to understand one of the fundamental signatures of trapping effects, the significantly different charge and discharging time constants, and its impact on power amplifier nonlinear distortion behavior. Then, some widely adopted approaches of the channel current transients’ characterization are addressed and the talk concludes by presenting some illustrative cases of application to RF high power amplifiers.
Speaker: Jose C. Pedro
José C. Pedro received the Diploma, Ph.D., and Habilitation degrees in electronics and telecommunications engineering from the Universidade de Aveiro, Aveiro, Portugal, in 1985, 1993, and 2002, respectively.
He is currently a Full Professor with the Universidade de Aveiro and head of the Aveiro site of the Instituto de Telecomunicações. He has authored 2 books and authored or co-authored more than 200 papers in international journals and symposia. His current research interests include active device modelling and the analysis and design of various nonlinear microwave circuits.
Dr. Pedro was a recipient of various prizes including the 1993 Marconi Young Scientist Award, the 2000 Institution of Electrical Engineers Measurement Prize, the 2015 EuMC Best Paper Microwave Prize, and the Microwave Distinguished Educator Award. He has served the scientific community as a Reviewer and an Editor for several conferences and journals, namely, the IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, for which he was the Editor-in-Chief.
Date: October 7th 2020
Time: 5:00 – 6:30 pm EDT
Venue: Online – http://bit.ly/DJKYPAAS
Event Contact: Daniel J King (danieljamesking3@gmail.com)
IEEE Ottawa Young Professional Affinity Group presents an Antenna Arrays Seminar by MASc. Daniel J. King. Feel free to register and join us in this exciting event. Some of the topics covered are:
- A basic introduction to the theory and practice of antenna arrays;
- Information about current research opportunities and applications;
- Specific examples in mm-Wave applications!
Register today to this virtual event!
More info here: https://www.ieeeottawa.ca/wp-content/uploads/2020/09/antennas.pdf
