Physics and Modeling of Vias in Printed Circuit Boards
Speaker :  Prof. Dr. Christian Schuster, Technische Universität Hamburg-Harburg
Date    :  Thursday September 5, 2013
Time    :   6:00 PM to 8:00 PM
Location :Â Â FIDUS SYSTEMS Inc.,35 Fitzgerald Road, Suite 400, Ottawa, ON,K2H 1E6
Admission:Â Â Free, and is on a first to reply basis.
Preference given to IEEE EMC/MTT/AP society members.
Seating is limited. E-mail Reservation is required.
Pizza and soft drinks will be served.
Contact :  Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Office :(613) 828-0063 Ext. 377, Cell:Â (613) 355 – 6632
Dr. Qingsheng Zeng , Chairman of the IEEE Ottawa MTT/AP Chapters
[qingsheng.zeng@crc.gc.ca]Abstract
This presentation gives an overview of the current understanding and simulation of electromagnetic fields around vias in printed circuit boards with a focus on the so called physics based via model. It is intended for an audience that has a basic knowledge of electromagnetic theory and network theory. Topics that will be addressed include the physics of parallel plane modes and their impact on via behavior, equivalent circuit models for signal vias, effect of ground vias, and the impact of floating planes on signal transmission.
Biography:
Christian Schuster (S’98 – M’00 – SM’05) received the Diploma degree in physics from the University of Konstanz, Germany, in 1996, and the Ph. D. degree in electrical engineering from the Swiss Federal Institute of Technology (ETH), Zurich, Switzerland, in 2000. Since 2006 he is full professor and head of the Institute of Electromagnetic  theory at the Hamburg University of Technology (TUHH), Germany. Prior to that he was with the IBM T. J. Watson Research Center, Yorktown Heights, NY, where he was involved in high-speed optoelectronic package and backplane interconnect modeling and signal integrity design for new server generations. His currents interests include signal and power integrity of digital systems, multiport measurement and calibration techniques, and development of electromagnetic simulation methods for communication electronics.
Dr. Schuster received the IEEE Transactions on EMC Best Paper Award in 2001, IEC DesignCon Paper Awards in 2005, 2006, and 2010, three IBM Research Division Awards between 2003 and 2005, IBM Faculty Awards in 2009 and 2010, and an award for the best interactive presentation at DATE-Europe in 2009. He is a member of the German physical Society (DPG) and several technical program committees of international conferences on signal and power integrity and electromagnetic compatibility. He is  currently serving as a Distinguished Lecturer for the IEEE EMC Society in the period 2012-2013.