Full Paper Submission Deadline: 1st July 2011.

The call for papers for the EPEPS-2011 (co-sponsored by CPMT and MTT
socities) is posted at our website http://epeps.org. The deadline for
submission of manuscripts is July 01, 2011. The conference is held during
Oct. 23-26, 2011, in the Silicon Valley, San Jose, CA. Also there are
great opportunities this time for industries to showcase their
products/brands through structured sponsorships/exhibitions. For more
information, please contact EPEPS administrator:
epeps-admin@illinois.edu. We look forward to your
submissions/participation in this premier conference on High-Speed
Signal/Power integrity, 3D Interconnects and Electronic Packaging.

EPEPS General Co-Chairs: Ram Achar & Brian Young