IEEEXtreme is a worldwide Annual Hackathon, in which teams of IEEE student members participate against each other in a span of 24 hours to solve a set of programming problems. This year IEEEXtreme 14.0 is being held on October 24th. Ragunath Anbarasu, the web master and an active volunteer of IEEE WIE Ottawa has been selected as the Ambassador and Section Lead for the Ottawa region. In this session, he will walk through the IEEEXtreme competition and WIE HACK613, a mock hackathon IEEE WIE Ottawa is organizing as a practice for IEEEXtreme. Register Now! And learn more about the event!
Speaker Bio:
Ragunath Anbarasu is currently doing his Masters in Electrical and Computer Engineering with Specialization in Data Science at Carleton University. He as been the Web Master of IEEE WIE Ottawa for almost a year and is extremely active in volunteering activities related to IEEE. He has been coordinating with the organizers in hosting this years IEEEXtreme Programming Competition in their respective student branches and supporting Non-IEEE Student Branch Members to get exposure to the Hackathon. He will be extending his help to students looking for support and guidance with information related to IEEEXtreme and connect them to a professional member.
Presented by the IEEE Ottawa Section Chapters of Electromagnetic Compatibility (EMC) Society, Components, Packaging and Manufacturing Technolog (CPMT) Society, Joint Chapter of Electron Devices (ED), Circuits and Systems (CAS), and Solid-State Circuits (SSCS) Society, Microwaves/Antennas/Propagation (AP, MTT) Society:
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
by Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Date: Wednesday, September 16th, 2020
Time: 5:00 PM to 6:00 PM EST
Location: Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.
Abstract:
Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.
Speaker Bio:
Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV and interposer technologies for heterogeneous system integration.
Summary:
As the COVID-19 Pandemic demonstrated, almost all Indigenous and remote communities suffered from serious infrastructure deficits. With limited or unreliable Internet, poor quality electricity, and weak health care services, these communities were uniquely vulnerable to the disease and the economic and social challenges that accompanied the pandemic. But Canadians already knew that Indigenous and remote communities are poorly served and largely lift out of the so-called “innovation economy.” It is time to develop a strategy for bringing technology-enabled opportunities to Indigenous and remote communities. This webinar presents a model for digitally-enabled Indigenous and remote communities, explores the barriers to implementing this “inversion” of Canadian innovation and that contemplates strategies for addressing quality of life issues in collaboration with residents and local governments.
Speaker Bio:
Ken Coates is Canada Research Chair in Regional Innovation at the Johnson-Shoyama Graduate School of Public Policy, University of Saskatchewan. His work focuses on the development of strategies to promote 21st century well-being in small town, rural, Indigenous and remote Canada. Ken’s major project examines the potential contributions — and negative impacts — of emerging technologies on rural and remote communities.
For more information and speaking opportunity, please contact, Dr Kexing Liu, IEEE Canada Outreach and Partnership Committee Chair, kexing.liu@ieee.org
Presented by IEEE Ottawa Young Professionals (YP) Affinity Group:
IEEE Ottawa Young Professionals Affinity Group Hall of Fame Award
We are excited to announce that we were awarded the 2020 IEEE Young Professionals Hall of Fame Award. This award is a certification that IEEE Ottawa YPAG has been classified as one of the top YPAGs worldwide based on our 2019 activities. It also represents all the commitment and dedication from our previous and current members lead by Zied Bouida (2018-2019) and Mohamed Emara (2019 - present).
We would like to thank IEEE Canada Board for their continuous support, faculty members from Carleton University, University of Ottawa and Algonquin College (special thanks to Prof. Halim Yanikomeroglu, Prof. Mohamed Ibnkahla, and Prof. Wahab Almuhtadi) for collaborating in organizing events, and our industry contacts who provided speakers and supported our events (special thanks to Michael Lalonde). Thanks also go to IEEE Ottawa Student Branches, IEEE Women In Engineering Ottawa, and IEEE Local Technical societies for organizing joint events and inviting distinguished speakers (special thanks to IEEE ComSoc/CESoc/BTS and IEEE MTT-S).
A special thanks go to Anis Ben Arfi for initiating and supporting our Nomination to the Hall of Fame Award, we are very honoured to see this prestigious award come back to Canada after five years. Thanks again to all our previous and current executive members and volunteers that made such an outstanding achievement possible!
Presented by the Ottawa Section Awards and Recognitions Committee:
Call for Nominations for the IEEE Ottawa Section Annual Awards 2020
IEEE Ottawa Section presents every year at its Annual General Meeting (AGM) the Year IEEE Ottawa Section Awards as recognition for its members, volunteers, chapters, affinity groups and student branches as well as recognition and appreciation for the industry and organizations. Please take this opportunity to accomplish something good and of great value to our profession and engineering community by submitting your nominations to a colleague, group, company or organization for recognition by an award from our section. This year, because of COVID-19, the Awards Ceremony will be held as a virtual event.
The deadline for submitting nominations for the following Awards is September 20th, 2020:
