Events

Jun
2
Sun
IEEE Ottawa Robotics Competition 2019 @ Earl of March Secondary School
Jun 2 @ 08:00 – 17:00

Arduinos, 3D printing, Lego Mindstorms and displays, submarine
robots, and AI, where can you find all this? All of this and MUCH MORE will be at the IEEE Ottawa Robotics
Competition (ORC), Ottawa’s largest robotics competition for grade 5 to 12
students. The ORC is taking place on Sunday,
June 2nd
at Earl of March
Secondary School
. Best times to show up are between 10:30 am to 12:30 pm and 1:30 pm to 4 pm. The ORC is completely
open to the public, so invite your friends and family too!

Check out previous competitions at https://youtube.com/user/ieeeorc/videos.

If you have any questions, please feel free to email us at orcinfo@ieeeottawa.ca.

Jun
20
Thu
Distinguished Lecture by Professor Mohamed-Slim Alouini “Smart Villages: When Connectivity Meets Affordability” @ Carleton University, ME4463
Jun 20 @ 13:00 – 14:00
Distinguished Lecture by Professor Mohamed-Slim Alouini "Smart Villages: When Connectivity Meets Affordability" @ Carleton University, ME4463   | Ottawa | Ontario | Canada

The role of Internet and Communication Technology (ICT) in
bringing about a revolution in almost all aspects of human life needs no
introduction. It is indeed a well-known fact that the transmission of
information at a rapid pace has transformed all spheres of human life such as
education, health, and economy to name a few. In addition, with the advent in
Electronics and Photonics Technology (EPT), we have observed sustained growth
and expansion in computation and display technology. From user demography
perspective, urbanized population are the major beneficiary of such advances.
Therefore, the benefits of ICT and EPT are yet to be experienced by almost 4
billion people in the world who are still “unconnected or under-connected” and
suffer as such from the “digital divide,” a term coined in order to emphasize
the lack of ICT infrastructure in many parts of the world.

Major challenges for widespread adoption of ICT and EPT in
these areas are related to cost, lack of power supply, and complexities
associated with learning and usage. However, if we can categorically overcome
these challenges, then these technologies can be used for food, water, shelter,
energy, environment, education, healthcare, and security. In addition, the
wide-spread availability of these technologies, will lead to smart suburbs,
smart towns, smart villages, etc., without the need to necessarily live in
smart cities. This would reverse the trend and allow a more sustainable world
with a more balanced distribution of the population density. In this context,
this talk will present recently proposed solutions to provide high speed
connectivity in rural areas along progress in affordable electronics to serve
and contribute to the development of far-flung regions.

In particular, new solutions for both: (i) integrated
satellite-airborne-ground networks providing global coverage and connectivity
and (ii) terrestrial mesh/multi-hop directive networks connecting underserved
areas will be discussed.

Moreover, some examples of democratized wearable
electronics using Do-It-Yourself (DIY) assembly of paper along Android DIY
applications capturing and displaying vital health signs over connected
smartphones for real-time diagnosis will be presented.

Jul
17
Wed
An Evening with Power Integrity Experts @ Fidus Systems, Ottawa
Jul 17 @ 17:00 – 19:30

Speaker 1: Hisham Abed, P.Eng., Ericsson

Topic: Power Integrity – Best design practices

Speaker 2: Dr. Ihsan Erdin, Celestica

Topic: Power Integrity Optimization amidst MLCC shortage

Parking: Free

Registration:  Free, and is on a first to reply basis. Preference given to IEEE EMC and CPMT society members. Seating is limited. E-mail reservation is required.

Pizza and soft drinks will be served.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa
EMC chapter

Syed.Bokhari@fidus.com,

Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

 

Directions:    www.fidus.com

Sep
16
Wed
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Sep 16 @ 17:00 – 18:00
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication                Applications

IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:

Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.

Speaker Bio:

Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.

Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.

Oct
7
Wed
Antenna Arrays Seminar
Oct 7 @ 17:00 – 18:30
Antenna Arrays Seminar

Date: October 7th 2020

Time: 5:00 – 6:30 pm EDT

Venue: Online – http://bit.ly/DJKYPAAS

Event Contact: Daniel J King (danieljamesking3@gmail.com)

IEEE Ottawa Young Professional Affinity Group presents an Antenna Arrays Seminar by MASc. Daniel J. King. Feel free to register and join us in this exciting event. Some of the topics covered are:

  • A basic introduction to the theory and practice of antenna arrays;
  • Information about current research opportunities and applications;
  • Specific examples in mm-Wave applications!

Register today to this virtual event!

More info here: https://www.ieeeottawa.ca/wp-content/uploads/2020/09/antennas.pdf

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