Events

Apr
22
Wed
IEEE Ottawa Seminar Series on AI and Machine Learning
Apr 22 @ 12:00 – 13:30

IEEE Ottawa Seminar Series on AI and Machine Learning

IEEE Ottawa Section, PHO
Chapter, CS Chapter, SP Chapter, TEMS Chapter

Jointly with Vitesse
Reskilling

The Rise & Foreseeable Future of
Artificial Intelligence:
Observations from a Commercial Pioneer

Peter MacKinnon

Synergy Technology
Management

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Wednesday, April 22, 2020

On-line Webinar

112:00 non – 13:30

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Artificial Intelligence (AI) is constantly in the news
with stories of promise and peril.
Political leaders have declared it a national priority, the global high
tech industry is racing AI apps to markets and policy and governance implications
of AI are in their infancy.  We will
explore where this is all heading.

We will begin with some definitions and a bit of
history behind the rise of AI.  The talk
will then place AI in the context of being a potentially disruptive technology
on society. This will lead to a discussion about ethics and moral issues
regarding the development and use of aspects of AI as a dual-use
technology.  Time permitting, the role of
AI in defence and security will be used as an example for appreciating the complexity
and ethical issues brought on by AI. We will then turn to the role of the
engineer in this new world being enabled by AI.

Finally, we will review potential governance and
policy issues and options to address the rapid unchecked development and
application of AI within society at large; and, ultimately end with a
precautionary note.

 

Biography

The speaker was
a pioneer in the commercialization of AI in the 1980s and today is actively
involved in ethical and policy issues related to AI.  Peter has an extensive background on the
forefront of scientific and technological breakthroughs around disruptive
technologies and their impacts on society.
He was an early proponent in the development and promotion of Big Data
and data analytics using High Performance Computers, and was a major
contributor in creating the Internet in Canada, among other accomplishments.

Peter has a
background as a scientist, business manager, entrepreneur, domestic and
international bureaucrat, executive, diplomat, management advisor, and
academic; including most recently affiliation with both Telfer School of
Management and the Faculty of Engineering at the University of Ottawa and the
Faculty of Engineering at Carleton University.
Peter also blogs on AI for the Institute on Science, Society and Policy,
an interfaculty organisation at uOttawa.

 

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Event
is free, but space is limited.  All
participants must register in advance.   

Please
follow the link to register

https://events.vtools.ieee.org/m/226058

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For more information,
please contact: Kexing Liu kexing.liu@ieee.org

May
26
Tue
Clarifying the Path to becoming a Professional Engineer
May 26 @ 12:00 – 14:00
Clarifying the Path to becoming a Professional Engineer

In this time of social distancing, we are pleased to announce that all the team members of IEEE YP and WIE Ottawa Sections are fully committed to providing online interaction and support to our community! In partnership with Professional Engineers Ontario, we present an online talk in “Clarifying the Path to Becoming a Professional Engineer.”

If you are an engineering undergraduate or post-graduate student, or a recent graduate starting out your engineering career, then this seminar might be for you. In it you will learn:

  • What is PEO?
  • What engineering experience is PEO looking for once I graduate?
  • I have international engineering education and experience; how is that evaluated by PEO?
  • How is my engineering experience evaluated by PEO?
  • How do I prepare my Experience Record?
  • What is the PPE?
  • What is the EIT Program and the Student Membership Program?

The emphasis of this webinar will be on the P. Eng. licensure process – what PEO is looking for. The webinar will focus on how engineering experience is evaluated and how you can facilitate the process. Learn the dos and don’ts of preparing your licensing application for evaluation.

To participate, you will require: internet connection to view the webinar, phone access to dial into the conference for audio.

We look forward to speaking with you!

Sep
16
Wed
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Sep 16 @ 17:00 – 18:00
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication                Applications

IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:

Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.

Speaker Bio:

Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.

Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.

Sep
24
Thu
IEEE Canada Technology Leadership Monthly Webinar
Sep 24 @ 14:00 – 15:00

Date: Sept 24th, 2020

Time: 02:00 PM to 03:00 PM EDT

Speaker: Ken Coates, Professor, University of Saskatchewan

Topic: Technology-Enabled Indigenous and Remote Communities

Registration: https://events.vtools.ieee.org/m/238665 

Summary:

As the COVID-19 Pandemic demonstrated, almost all Indigenous and remote communities suffered from serious infrastructure deficits.  With limited or unreliable Internet, poor quality electricity, and weak health care services, these communities were uniquely vulnerable to the disease and the economic and social challenges that accompanied the pandemic.  But Canadians already knew that Indigenous and remote communities are poorly served and largely lift out of the so-called “innovation economy.”  It is time to develop a strategy for bringing technology-enabled opportunities to Indigenous and remote communities.  This webinar presents a model for digitally-enabled Indigenous and remote communities, explores the barriers to implementing this “inversion” of Canadian innovation and that contemplates strategies for addressing quality of life issues in collaboration with residents and local governments.

Biography:

Ken Coates is Canada Research Chair in Regional Innovation at the Johnson-Shoyama Graduate School of Public Policy, University of Saskatchewan. His work focuses on the development of strategies to promote 21st century well-being in small town, rural, Indigenous and remote Canada. Ken’s major project examines the potential contributions — and negative impacts — of emerging technologies on rural and remote communities.

For more information and speaking opportunity, please contact, Dr Kexing Liu, IEEE Canada Outreach and Partnership Committee Chair, kexing.liu@ieee.org

Oct
7
Wed
Antenna Arrays Seminar
Oct 7 @ 17:00 – 18:30
Antenna Arrays Seminar

Date: October 7th 2020

Time: 5:00 – 6:30 pm EDT

Venue: Online – http://bit.ly/DJKYPAAS

Event Contact: Daniel J King (danieljamesking3@gmail.com)

IEEE Ottawa Young Professional Affinity Group presents an Antenna Arrays Seminar by MASc. Daniel J. King. Feel free to register and join us in this exciting event. Some of the topics covered are:

  • A basic introduction to the theory and practice of antenna arrays;
  • Information about current research opportunities and applications;
  • Specific examples in mm-Wave applications!

Register today to this virtual event!

More info here: https://www.ieeeottawa.ca/wp-content/uploads/2020/09/antennas.pdf

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