Events

Nov
28
Thu
Modern Day Applications of Power Electronics – Who Can Benefit? @ Room P208, Algonquin College
Nov 28 @ 18:00 – 20:00
Modern Day Applications of Power Electronics – Who Can Benefit? @ Room P208, Algonquin College | Ottawa | Ontario | Canada

Seminar by IEEE Ottawa Section, PELS, SSIT, RS-PEL, PES, Education Activities, Algonquin College IEEE Student Branch, ComSoc, CESoc, and BTS Ottawa Joint Chapter.

The IEEE Ottawa Section is inviting all interested IEEE members and nonmembers to a seminar

Modern Day Applications of Power Electronics – Who Can Benefit?

By 

Kalyan K. Sen

Sen Engineering Solutions, Inc.

DATE:

November 28th 2019

TIME:
Refreshments, Registration and Networking:
18:00;
Seminar:
18:30 – 20:00.

PLACE:
Algonquin College, Room P208, 1385 Woodroffe Ave., Ottawa.

PARKING:

Parking in Lots 8 and 9 after 5 p.m. is $5 flat rate, pay at a
machine and display the ticket on your dashboard.

 

ADMISSION:

Free. Registration required.

Please register by e-mail contacting: ottawapels@gmail.com

 

Abstract:

Application of power electronics is widespread in everyday life. Some applications are considered as “nice to have it;” in other cases, they are essential. This presentation discusses a wide variety of daily-used applications around the world. Also covered is an advanced topic, such as SMART Controller that today’s grid requires for voltage regulation, power factor regulation, unbalance voltage/current regulation, harmonic elimination and so on. A SMART Controller that is based on functional requirements and cost-effective solutions is derived from utilizing the best features of all the technical concepts that are developed until now. Final year students of electrical engineering undergraduate curriculum, post graduate students, researchers, academicians and utility engineers will benefit from attending this course. The participantswill hear from an expert who actually designed and commissioned a fewutility-grade SMART controllers since their inception in the 1990s.

 

Modern Day Applications of Power Electronics – Who Can Benefit
May
26
Tue
Clarifying the Path to becoming a Professional Engineer
May 26 @ 12:00 – 14:00
Clarifying the Path to becoming a Professional Engineer

In this time of social distancing, we are pleased to announce that all the team members of IEEE YP and WIE Ottawa Sections are fully committed to providing online interaction and support to our community! In partnership with Professional Engineers Ontario, we present an online talk in “Clarifying the Path to Becoming a Professional Engineer.”

If you are an engineering undergraduate or post-graduate student, or a recent graduate starting out your engineering career, then this seminar might be for you. In it you will learn:

  • What is PEO?
  • What engineering experience is PEO looking for once I graduate?
  • I have international engineering education and experience; how is that evaluated by PEO?
  • How is my engineering experience evaluated by PEO?
  • How do I prepare my Experience Record?
  • What is the PPE?
  • What is the EIT Program and the Student Membership Program?

The emphasis of this webinar will be on the P. Eng. licensure process – what PEO is looking for. The webinar will focus on how engineering experience is evaluated and how you can facilitate the process. Learn the dos and don’ts of preparing your licensing application for evaluation.

To participate, you will require: internet connection to view the webinar, phone access to dial into the conference for audio.

We look forward to speaking with you!

Jul
7
Tue
A Novel Maximum Power Point Tracking (MPPT) Technique for Photovoltaic Solar Panels
Jul 7 @ 18:00 – 19:30
A Novel Maximum Power Point Tracking (MPPT) Technique for Photovoltaic Solar Panels

The IEEE Reliability Society & Power Electronics
Society is inviting all interested IEEE members and prospective members to a
webinar

 

A Novel Maximum Power Point Tracking (MPPT) Technique for Photovoltaic Solar Panels

By

 

Mahdi Ranjbar

DATE:       July 7, 2020

TIME:        18 19:30.

       

A
novel Maximum Power Point Tracking (MPPT) technique for photovoltaic (PV)
solar panels will be presented.  Current
sensors are costly components. They also require a signal conditioning
circuitry to reduce the noise and condition the signal to be sampled and used
by the controller.  Th
is
method takes advantage of the non-linearity of the I-V curve of the solar panel
to
find the MPP
. By injecting high-frequency perturbation signals and
monitoring the system behavior current sensing used for controlling of MPPT
is eliminated. This elimination can reduce the cost of MPPT circuitry. The proposed method also shows a very fast tracking response due to the use of high-frequency signals instead of relying on low frequency and DC signals which are used in the traditional methods. Numerical analysis, simulation results, and experimental results verify the feasibility of the proposed technique will be shown.

 

Mahdi
Tude Ranjbar received his bachelor’s degree from the University of Tehran,
Iran (2017). In this period, his main focus was on collaboration with different laboratories in ECE and Mechanical engineering departments. He started his M.A.Sc degree in 2018 at Queen’s, Canada with a focus on improving the efficiency of the solar system power generation techniques.  Since March 2020, Mr. Ranjbar has joined the System
Architecture group at HUADA Semiconductors where his main focus is designing power applications using Huada’s microcontrollers, gate drivers and current sense amplifiers.


Please
register here:
 https://events.vtools.ieee.org/tego_/event/manage/233724

A link will be sent to you a day before the event.

 

Sep
16
Wed
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Sep 16 @ 17:00 – 18:00
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication                Applications

IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:

Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.

Speaker Bio:

Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.

Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.

Oct
7
Wed
Antenna Arrays Seminar
Oct 7 @ 17:00 – 18:30
Antenna Arrays Seminar

Date: October 7th 2020

Time: 5:00 – 6:30 pm EDT

Venue: Online – http://bit.ly/DJKYPAAS

Event Contact: Daniel J King (danieljamesking3@gmail.com)

IEEE Ottawa Young Professional Affinity Group presents an Antenna Arrays Seminar by MASc. Daniel J. King. Feel free to register and join us in this exciting event. Some of the topics covered are:

  • A basic introduction to the theory and practice of antenna arrays;
  • Information about current research opportunities and applications;
  • Specific examples in mm-Wave applications!

Register today to this virtual event!

More info here: https://www.ieeeottawa.ca/wp-content/uploads/2020/09/antennas.pdf

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