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“A Candid Conversation on 5G”
Dr. Ibrahim Gedeon
CTO, Telus
Ibrahim Gedeon is one of the global telecommunications industry’s eminent thought leaders. He has carved out an international career by combining tremendous insight and skill as an applied scientist with a lighthearted and non-conventional approach to leadership. As Chief Technology Officer for TELUS a leading national telecommunications company in Canada, he is responsible for all technology development and strategy, security, service and network architecture, service delivery and operational support systems, as well as service and network convergence, and network infrastructure strategies and evolution. Under his leadership the TELUS wireless broadband network has become one of the best in the world.
Ibrahim also serves on the board of the Next Generation Mobile Networks Alliance, the Alliance for Telecommunications Industry Solutions and the Institute for Communication Technology Management. He has a Bachelor’s degree in Electrical Engineering from the American University of Beirut and a Master’s in Electronics Engineering from Carleton University. In 2010, Ibrahim received a Honourary Doctor of Laws degree from the University of British Columbia. In 2014, he was elected as a Fellow of the Canadian Academy of Engineering (CAE) in recognition of his significant contributions to the field of engineering. He has been named five times to the Global Telecoms Business magazine’s GTB Power 100, a list of the 100 most powerful and influential people in the telecoms industry.
Ibrahim served in many IEEE executive and leadership posts on the Society, Region, Section, and Chapter level. He is currently the Senate Chair of IEEE Ottawa Section, the Industry Advisor of the IEEE Communications Society for the North America Region, and the Industry Advisor for the IEEE Consumer Electronics Society. Ibrahim is very well known a keynote speaker, he organized and hosted several national and international conferences. He was the General Chair of the 2012 IEEE International Conference on Communications – ICC2012 (IEEE Communications Society’s flagship conference), and he is currently the General Chair of the 2021 IEEE International Conference on Communications – ICC2021 that will be held in Montreal on June 14-18, 2021. He received many awards, just to name few, the Consumer Electronics Society’s Distinctive Exemplary Industry Leader Award in 2019, and the IEEE Canada’s Outstanding Canadian Engineer Award in 2001.
On behalf of the conference organizing committee,
we invite you to the virtual Photonics North Conference on May 26-28,
2020. In the midst of a global crisis,
we look forward to meeting with all of you, our colleagues, as we carry on with
the work of advancing optical science and engineering. Join us for outstanding
plenary talks from inspirational thought leaders. Join us for the very best
work from respected and established researchers. Join us for talks from
emerging researchers, presenting what is surely the opening work of brilliant,
burgeoning careers.
Photonics and optics are finally seeing widespread adoption and significant growth into new markets. Photonic devices are being applied to sensing, communications, and even quantum computing. High speed fiber optics and highly integrated subsystems are essential to the rollout of 5G systems. There has never been a better time for research, development, and training in photonics and Photonics North is essential for developing and promoting the ecosystem.
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Conference Chairs
Gord Harling
President and CEO, CMC Microsystems   Â
P. Scott Carney
The Institute of Optics, University of Rochester​   Â
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The IEEE Reliability Society & Power Electronics  A Novel Maximum Power Point Tracking (MPPT) Technique for Photovoltaic Solar Panels By  Mahdi Ranjbar DATE:      July 7, 2020 TIME:       18 – 19:30.     A  Mahdi
A link will be sent to you a day before the event. Â |
Speaker:        Dr : Marin Soljacic, MIT
Date:Â Â Â Â Â Â Â Â Â Â Â Wednesday
Aug 12th, 2020
Time: Â Â Â Â Â Â Â Â Â Â Â 12:00
noon to 13:00
Title of the talk: Â Â Â Photonics:
a great testing-ground to develop new AI algorithms for science
IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:
Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.
Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632
Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.
Speaker Bio:
Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.
Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.
