Technological Stewardship is a new concept intended to focus on the promise of technology to create a better future for society today and avoid the negative consequences. While Technologies have the promise to address key issues and create a better future, new developments often amplify inequities and create new kinds of risk. What does this mean for how to move
Through this interactive 2-hour workshop, you will learn about Technological Stewardship and develop your ability to ensure technology makes the world a better place for all. You will also be introduced to a powerful tool for practically integrating these concepts into the product design/development process.
Mark Abbott is the Executive Director of the Engineering Change Lab, which serves as a catalyst for evolving the engineering community to reach its full potential as stewards of technology for the benefit of humanity.Â Over the past 5 years, over 125 organizations and 350+ individual leaders (CEOs, VPs, Deans, Directors) have collaborated using the Lab’s platform advancing understanding and action to evolve engineering. Previously, Mark served as member of the Executive Team at Engineers without borders for several years.
This interactive workshop is limited to 45 attendees so as to create an optimal interactive and learning environment.Â This series of workshops is planned to have subsequent workshops taking place in March and April.Â We are especially interested in professionals willing to tryout the powerful tools and providing feedback on integrating the concepts into the product design / development process.
IEEE Ottawa Seminar Series on AI and Machine Learning
IEEE Ottawa Section, PHO Chapter,
CS Chapter, SP Chapter, TEMS Chapter
Jointly with Vitesse
The Rise & Foreseeable Future of
Observations from a Commercial Pioneer
Wednesday, March 18, 2020
359 Terry Fox Drive, Suite 200, Kanata, Ontario
11:30 â€“ 13:30
Artificial Intelligence (AI) is constantly in the news
with stories of promise and peril.
Political leaders have declared it a national priority, the global high
tech industry is racing AI apps to markets and policy and governance
implications of AI are in their infancy.
We will explore where this is all heading.
We will begin with some definitions and a bit of
history behind the rise of AI.Â The talk
will then place AI in the context of being a potentially disruptive technology
on society. This will lead to a discussion about ethics and moral issues
regarding the development and use of aspects of AI as a dual-use
technology.Â Time permitting, the role of
AI in defence and security will be used as an example for appreciating the
complexity and ethical issues brought on by AI. We will then turn to the role
of the engineer in this new world being enabled by AI.
Finally, we will review potential governance and
policy issues and options to address the rapid unchecked development and
application of AI within society at large; and, ultimately end with a
The speaker was
a pioneer in the commercialization of AI in the 1980s and today is actively
involved in ethical and policy issues related to AI.Â Peter has an extensive background on the
forefront of scientific and technological breakthroughs around disruptive
technologies and their impacts on society.
He was an early proponent in the development and promotion of Big Data
and data analytics using High Performance Computers, and was a major
contributor in creating the Internet in Canada, among other accomplishments.
Peter has a
background as a scientist, business manager, entrepreneur, domestic and
international bureaucrat, executive, diplomat, management advisor, and
academic; including most recently affiliation with both Telfer School of
Management and the Faculty of Engineering at the University of Ottawa and the
Faculty of Engineering at Carleton University.
Peter also blogs on AI for the Institute on Science, Society and Policy,
an interfaculty organisation at uOttawa.
is free, but space is limited.Â All
participants must register in advance.Â Â
follow the link to register
more information, please contact: Kexing Liu email@example.com
Presented by IEEE MTT-S Distinguished Microwave Lecturer (DML) Talks:
Transceiver Architectures for Beyond-5G: Challenges and R&D Opportunities, co-organized with SSC-S
Dr. Payam Heydari
University of California, Irvine
Date: Thursday, May 14 , 2020
Time: 12:00 PMÂ – 1 PM
The ongoing super-linear growth of worldâ€™s population coupled with the worldwide access to internet and the general publicâ€™s tendency to use more bandwidth-intensive applications fuel the urgency to enhance wireless infrastructures so as to meet these demands. Consequently, the wireless R&D is headed towards the inception of “Beyond-5G” (e.g., 6G) technology.Â This webinar provides a comprehensive overview of challenges and opportunities in designing beyond-5G transceiver architectures capable of achieving high data rates above and beyond 20 Gbps.Â
Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Speaker Bio:
Payam Heydari received his Ph.D. degree from the University of Southern California in 2001. He is currently a Full Professor of Electrical Engineering at the University of California, Irvine. Dr. Heydari’s research covers the design of terahertz/millimeter-wave/RF and analog integrated circuits. He is the (co)-author of two books, one book chapter, and more than 150 journal and conference papers.Â
Dr. Heydari is an AdCom member of the IEEE Solid-State Circuits Society. Dr. Heydari currently serves an Associate Editor for the IEEE Journal of Solid-State Circuits and the IEEE Solid-State Circuits Letters. He was a member of the Technical Program Committee of the International Solid-State Circuits Conference (ISSCC). Dr. Heydari is an IEEE Fellow for contributions to silicon-based millimeter-wave integrated circuits and systems.
Â Â Â Â Â Â Â Â Event is free, but space is limited. Â All participants must register in advance. ForÂ Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Registration: please use the following link
Presented by the IEEE Ottawa Section MTT-S/AP-S Chapter & Young ProfessionalsÂ
Accelerating 5G Design Innovation Through SimulationÂ
Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â By
Dr. Laila SalmanÂ
Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Ansys Inc.
Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Date: Wednesday, June 10, 2020
Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Time: 2:30 PMÂ – 4:00 PM
Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Location: Online
Â Â Â Â Â Â Â Â Â Â Â Â
5G connectivity is the next technological revolution. This pervasive, ultrafast compute network will connect billions of devices with data on-demand. It will drive economic expansion in many sectors, spawn new products and services, and transform our lives as we know it.Â Yet, before 5G can deliver on its promises and quality of service (QoS) metrics, wireless systems designers and engineers must overcome sizable challenges.Â Â
Ansys 5G simulation solutions empower these individuals to solve the complexities impeding device, network and data center design.Â Ansys 5G simulation solutions provide electromagnetics, semiconductor, electronics cooling and mechanical analysis tools to accurately simulate 5G radio and related technologies. The multi-solution platform leverages high-performance computing that can be deployed across the enterprise, allowing designers and engineering experts to collaborate more effectively.Â
This seminar will highlight the following 5G engineering challenges:Â
Â·Â Â End User EquipmentÂ Â
Â Â oÂ Â multi-frequency band antenna integrationÂ
Â Â oÂ Â Â modeling of mm-wave array antennasÂ Â
Â Â oÂ Â Â RFI, EMI & Desense MitigationÂ
Â·Â Â Base-Station Antenna ModelingÂ
Â Â o Â Full Communication Analysis in Electrically Large & Complex EnvironmentÂ
Â Â o Â RFI, Data Coverage &Â ElectroThermalÂ ReliabilityÂ
Dr. Laila Salman received the B.S. and M.S. degrees in electronics and communication engineering from Cairo University, Egypt, and the PhD. Degree in electromagnetic and antenna design from the University of Mississippi. She also worked as a post-doctoral student at the UniversitÃ© de Quebec en Outaouais, Gatineau, Canada till 2010.Â Her research was on dielectric resonator antennas, wearable antennas, microwave and millimeter-wave circuits and systems, microwave imaging for early detection of breast cancer and scattering from left-handed metamaterials. Dr. Salman joined Ansys Canada Ltd. in August 2010 as a Lead Technical Services Specialist for High Frequency Applications.
Registration:Â Please use the link in the registration section toÂ sign upÂ for the event.
To join event use the followingÂ link.
IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:
Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.
Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632
Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.
Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.
Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.