Innovation enables organizations to open new avenues of product differentiation by customizing products. In today’s rapidly changing business environment, engineers must innovate quickly to incorporate new features while reducing development costs and delivering new products to the market before the competition. Simulation plays a key role in helping engineers drive innovation, enabling complete virtual prototypes of complex systems to be validated across all physics and engineering disciplines.
Join us as we return to Ottawa for our 4th Annual ANSYS Innovation Conference on May 8, 2019! This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.
What You Will Learn
- Experience new simulation capabilities that provide unprecedented design insight as they speed your time to market
- Incorporate various productivity enhancement tools and techniques into your engineering department’s workflow
- Gain insights into 5G system development with physics-based simulation and cover critical design issues, such as antenna performance, semiconductor reliability, and thermal integrity
- Identify signal integrity issues early in the design cycle for electronics IC packages, PCBs, connectors and other complex interconnects
- Modify antenna design, predict antenna efficiency and the overall thermal and EM performance of the product based on electromagnetic and thermal coupling solutions
Presented by IEEE MTT-S Distinguished Microwave Lecturer (DML) Talks:
Transceiver Architectures for Beyond-5G: Challenges and R&D Opportunities, co-organized with SSC-S
Dr. Payam Heydari
University of California, Irvine
Date: Thursday, May 14 , 2020
Time: 12:00 PM – 1 PM
The ongoing super-linear growth of world’s population coupled with the worldwide access to internet and the general public’s tendency to use more bandwidth-intensive applications fuel the urgency to enhance wireless infrastructures so as to meet these demands. Consequently, the wireless R&D is headed towards the inception of “Beyond-5G” (e.g., 6G) technology. This webinar provides a comprehensive overview of challenges and opportunities in designing beyond-5G transceiver architectures capable of achieving high data rates above and beyond 20 Gbps.
Payam Heydari received his Ph.D. degree from the University of Southern California in 2001. He is currently a Full Professor of Electrical Engineering at the University of California, Irvine. Dr. Heydari’s research covers the design of terahertz/millimeter-wave/RF and analog integrated circuits. He is the (co)-author of two books, one book chapter, and more than 150 journal and conference papers.
Dr. Heydari is an AdCom member of the IEEE Solid-State Circuits Society. Dr. Heydari currently serves an Associate Editor for the IEEE Journal of Solid-State Circuits and the IEEE Solid-State Circuits Letters. He was a member of the Technical Program Committee of the International Solid-State Circuits Conference (ISSCC). Dr. Heydari is an IEEE Fellow for contributions to silicon-based millimeter-wave integrated circuits and systems.
Event is free, but space is limited. All participants must register in advance. For Registration: please use the following link