IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:
Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.
Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632
Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.
Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.
Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.
Date: Sept 24th, 2020
Time: 02:00 PM to 03:00 PM EDT
Speaker: Ken Coates, Professor, University of Saskatchewan
Topic: Technology-Enabled Indigenous and Remote Communities
As the COVID-19 Pandemic demonstrated, almost all Indigenous and remote communities suffered from serious infrastructure deficits. With limited or unreliable Internet, poor quality electricity, and weak health care services, these communities were uniquely vulnerable to the disease and the economic and social challenges that accompanied the pandemic. But Canadians already knew that Indigenous and remote communities are poorly served and largely lift out of the so-called “innovation economy.” It is time to develop a strategy for bringing technology-enabled opportunities to Indigenous and remote communities. This webinar presents a model for digitally-enabled Indigenous and remote communities, explores the barriers to implementing this “inversion” of Canadian innovation and that contemplates strategies for addressing quality of life issues in collaboration with residents and local governments.
Ken Coates is Canada Research Chair in Regional Innovation at the Johnson-Shoyama Graduate School of Public Policy, University of Saskatchewan. His work focuses on the development of strategies to promote 21st century well-being in small town, rural, Indigenous and remote Canada. Ken’s major project examines the potential contributions — and negative impacts — of emerging technologies on rural and remote communities.
For more information and speaking opportunity, please contact, Dr Kexing Liu, IEEE Canada Outreach and Partnership Committee Chair, email@example.com
Date and Place: The event will be held online on September 26th and 27th, 2020.
“Every accomplishment starts with the decision to try” ~ John F. Kennedy
New to Hackathons? Are you also interested in participating in IEEEXtreme 14.0? IEEE WIE Ottawa presents the first ever Mock Hackathon in Ottawa! Win Exciting Prizes and get experience with us. No need to think of an idea! The questions will be given to you. Our mentors will further help you to get a head start in your hackathon journey! This is a practice event just for you! Learn more about IEEEXtreme here-> https://ieeextreme.org/
September 26th and 27th, 2020
The event is fully online including the mentorship*.
September 26th, 2020
01:00 PM The opening ceremony
02:00 PM Commencement of Hackathon
05:00 PM Final Submission
September 27th, 2020
01:00 PM Results declaration webinar
01:30 PM Prize announcement
02:00 PM The closing ceremony
For More Details Visit: https://wie.ieeeottawa.ca/hack613-the-ottawa-hackathon/
Online Talk: From bees to Drones: Exploring bio-inspired machine vision applications for precision agriculture
Bees are used as vectors for pollination and transport of agricultural chemicals in outdoor agriculture and greenhouses. However, in certain situations the use of natural pollinators is problematic. Small unmanned aerial vehicles (UAVs) could serve as an alternate pollination vector in such situations and perform other functions. A step towards the deployment of such a tool is to bring the ability to locate, classify, and analyze flowers aboard a drone.
A presentation by IEEE WIE Ottawa.
Date: October 7th 2020
Time: 5:00 – 6:30 pm EDT
Venue: Online – http://bit.ly/DJKYPAAS
Event Contact: Daniel J King (firstname.lastname@example.org)
IEEE Ottawa Young Professional Affinity Group presents an Antenna Arrays Seminar by MASc. Daniel J. King. Feel free to register and join us in this exciting event. Some of the topics covered are:
- A basic introduction to the theory and practice of antenna arrays;
- Information about current research opportunities and applications;
- Specific examples in mm-Wave applications!
Register today to this virtual event!