Events

Jun
20
Thu
Ottawa IEEE Lunch and Learn on state of the Canadian Internet @ CENGN (Center for Next Generation Networks)
Jun 20 @ 11:30 – 13:00

Status of the Internet in Canada and the importance of Canadian IXP’s

Jacques Latour

Chief Technology Officer, CIRA/.CA

A quick overview of the Canadian Internet exchange landscape from coast to coast to coast. Canada has its share of challenges and opportunities in building and growing the IXP infrastructure near the Canadian border, and also to support the need of the rural communities.

As an expert in developing innovative, leading-edge IT solutions, Jacques has established CIRA as a global leader among ccTLD registries. He has 25+ years of experience in the private and not-for-profit sectors and as CIRA’s CTO,is currently leading CIRA Labs, CIRA’s innovation hub and providing leadership and direction for the management and security of the .CA registry and its underlying DNS.

A visionary in the Internet community, Jacques led the development of CIRA’s Internet Performance Test, is an outspoken advocate for the adoption of IPv6 and represents the .CA registry internationally as a member of a variety of working groups and advisory groups, including being a member of ICANN’s Security and Stability Advisory Committee (SSAC), TLDOPS standing committees and TechDay and DNSSEC Planning Program Committee.

Jacques is committed to the development of a new Canadian Internet architecture. He has served as the catalyst for the creation of a national Canadian IXP association, CA-IX, and is a member of the Manitoba Internet Exchange’s (MBIX) and the DNS-OARC Board of Directors.

Jacques holds an Electronics Engineering Technologist diploma from Algonquin College in Ottawa, is ITIL v3 Foundation certified and is a certified Agile ScrumMaster.

Agenda

11:30 – 12:00  Lite Lunch, Networking, and Welcoming Remarks
12:00 – 13:00  Seminar

Fields-CQAM Public Lectures: What is missing from common practice in machine learning? @ Carleton University
Jun 20 @ 19:00 – 20:00

Fields-CQAM Public Lectures: Ali Ghodsi, University of Waterloo

 

What is missing from common practice in machine learning?

AI, and machine learning in particular, is enjoying its golden age. Machine learning has changed the face of the world over the past two decades but we are still a long way from achieving a general artificial intelligence. In this talk, I will discuss a couple of elements that I believe are missing from common practice in machine learning, including incorporating causality and creating a new framework for unsupervised learning.

 

Biography

 

Ali Ghodsi is a Professor in the Department of Statistics and Actuarial Science at the University of Waterloo. His research involves statistical machine-learning methods. Ghodsi’s research spans a variety of areas in computational statistics. He studies theoretical frameworks and develops new machine learning algorithms for analyzing large-scale data sets, with applications to bioinformatics, data mining, pattern recognition, robotics, computer vision, and sequential decision making.

DATE:

THURSDAY, JUNE 20TH, 2019.

PRESENTATION

6:00 PM – 7:00 PM.

NETWORKING

7:00 PM – 8:00 PM.

LOCATION

HEALTH SCIENCE BUILDING, RM. 1301 (LOCATED ON THE GROUND FLOOR), CARLETON UNIVERSITY.

FREE ADMISSION FOR THIS PUBLIC LECTURE.
PLEASE REGISTER HERE.

Jun
21
Fri
FIELDS CENTRE OF QUANTITATIVE MODELLING AND ANALYSIS: WORKSHOP ON Machine Learning in the Presence of Class Imbalance @ Residence Commons, Carleton University
Jun 21 @ 08:30 – 16:30
FIELDS CENTRE OF QUANTITATIVE MODELLING AND ANALYSIS: WORKSHOP ON Machine Learning in the Presence of Class Imbalance @ Residence Commons, Carleton University | Ottawa | Ontario | Canada

 

8:30 am – 9:00 am Registration
9:00 am – 9:15 am Opening Remarks Rafik Goubran Carleton University
9:15 am – 10:00 am Keynote Presentation:

Data Mining and Machine Learning for Authorship and Malware Analyses
Abstract

Benjamin C. M. Fung
Biography
McGill University
10:00 am – 10:30 am Break
10:30 am – 11:45 am Cybersecurity: Top 5 class imbalance ML challenges and data sets
Abstract
Stephan Jou
Biography
Interset
Class Imbalance in Fraud Detection
Abstract
Robin Grosset
Biography
MindBridge Analytics Inc.
Handling class imbalance in natural language processing
Abstract
Isuru Gunasekara
Biography
IMRSV Data Labs
11:45 am – 12:45 pm Lunch
12:30 pm – 2:10 pm Adaptive learning with class imbalanced streams
Abstract
Herna L. Viktor
Biography
University of Ottawa
Radar-based fall monitoring using deep learning
Abstract
Hamidreza Sadreazami
Biography
McGill University
Privacy-preserving data augmentation in medical text analysis
Abstract
Isar Nejadgholi
Biography
National Research Council
Failure modelling of a propulsion subsystem: unsupervised and semi-supervised approaches to anomaly detection
Abstract
Julio J. Valdés
Biography
National Research Council
2:10 pm – 2:25 pm Break
2:25 pm – 3:40 pm TBD Reddy Nellipudi DB Schenker
AuditMap.ai: Hierarchical Sentence Classification in Unstructured Audit Reports
Abstract
Daniel Shapiro
Biography
Lemay.ai
Deep Learning techniques for unsupervised anomaly detection
Abstract
Dušan Sovilj
Biography
RANK Software Inc.
3:40 pm – 3:50 pm Closing Remarks

 

Jul
17
Wed
An Evening with Power Integrity Experts @ Fidus Systems, Ottawa
Jul 17 @ 17:00 – 19:30

Speaker 1: Hisham Abed, P.Eng., Ericsson

Topic: Power Integrity – Best design practices

Speaker 2: Dr. Ihsan Erdin, Celestica

Topic: Power Integrity Optimization amidst MLCC shortage

Parking: Free

Registration:  Free, and is on a first to reply basis. Preference given to IEEE EMC and CPMT society members. Seating is limited. E-mail reservation is required.

Pizza and soft drinks will be served.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa
EMC chapter

Syed.Bokhari@fidus.com,

Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

 

Directions:    www.fidus.com

Sep
16
Wed
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Sep 16 @ 17:00 – 18:00
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication                Applications

IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:

Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.

Speaker Bio:

Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.

Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.

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