Clarifying the Path to becoming a P.Eng. with Representatives from Professional Engineers Ontario
Feb 27 @ 18:00 – 19:30
Clarifying the Path to becoming a P.Eng. with Representatives from Professional Engineers Ontario

A joint event by IEEE YP & WIE Ottawa!


WHO? Representatives from Professional Engineers Ontario
WHAT? Clarifying the Path to becoming a P.Eng.

you are an engineering undergraduate or post-graduate student, or a
recent graduate starting out your engineering career, then this seminar
might be for you. In it you will learn:

  • What is PEO?
  • What engineering experience is PEO looking for once I graduate?
  • I have international engineering education and experience; how is that evaluated by PEO?
  • How is my engineering experience evaluated by PEO?
  • How do I prepare my Experience Record?
  • What is the PPE?
  • What is the EIT Program and the Student Membership program?

Carleton University,
Minto Centre (MC) 5050
Paid Parking Available –

Thursday, February 27th, 2020
6:00PM to 7:30PM

Free for all – You MUST pre-register!

May 21 @ 14:00 – 15:00

Speaker: Suzanne
Grant of Canadian Advanced Technology Alliance

Topic: #TechnologyNorth – the gold standard

Suzanne envisions a world where a Made in Canada #TechnologyNorth seal is the global gold standard of quality, synonymous with leather shoes Made in Italy, grapes harvested in Champagne, and autos designed and manufactured in Germany. Canada’s world class innovators have delivered excellence decade over decade. Without adequate support of the sector through COVID19, this vision may be a non-starter. During economic difficulties Canada has traditionally bailed out traditional auto and airline industries, and innovative technologies like the AVRO Arrow, Nortel, Research In Motion, Cognos and aspiring young companies were orphaned. By failing to protect our  innovators, Canada traded in future traction of Canada’s valuable intellectual property. America, Europe and the Middle East hungry to prosper from our bargain IP and talent came out the winners. Each downturn has taken at least a decade for technology to reinvent itself and rebound.

We have a track record of great beginnings and a more mature Canada can weather the storms and aim for bigger commercial finish lines, where prosperity and job abundance translate to big returns. Before COVID19 struck, we were hitting our stride with record venture investments and sought after talent from leading education institutions. Canada’s Innovation Agenda demonstrated a maturing future view aiming to lead. This is no time to retreat! The government has invested on behalf of Canadians and accountable for a $36B year over year injection into innovation via universities and commercialization. This investment is at risk. Toronto was the fastest growing tech hub in North America with ICT and advanced technologies outpacing job and economic growth rates by almost twice the national average. As we look beyond COVID19, our technology sector, adequately supported through this crisis, can be the catalyst to jump start Canada’s future economy. With a troubled oil and gas sector, Canada will need agile, fast movers doing the heavy lifting to fund our social, health and education programs and rebuild the nation’s balance sheet.

And as we get back to shipping products and services, a more sophisticated approach to sales, branding, advocacy and public relations, layered with Canada’s science, technology, engineering and maths genius can place Canada out in front in multiple lanes. The digitization revolution just got a bump up and opportunities and demand will remain for trillion dollar market frontiers. Data, Internet of things and machine learning are golden.  Demand for artificial intelligence, environmental, medical and space solutions will continue to accelerate. Winning the future will take more collaboration, agility, commercial savvy and embracing diverse talent sets and creativity. We’ve got this Canada!

About The Canadian Advanced Technology Alliance
CATA is a trusted industry alliance with a mandate to help Canadian innovation thrive. They focus on commercial capabilities and market access for Canadian HQ small and medium technology businesses. The alliance brings together industry thought leaders with academe and policy makers to advocate for Canadian competitiveness. CATA amplifies a bold, confident podium culture amongst Canadian innovators. CATA recently proposed $3.6B in COVID emergency relief – the Resilience and Rebound Fund for tech small and medium companies.
CATA is home to the National Innovation Leadership Council, and a joint body with the Canadian Association of Chiefs of Police – the CACP/CATA E-Crimes Cyber Council. CATA is launching a President’s Council this Fall

Jun 22 @ 14:00 – 15:00
Speaker: Tom Coughlin of IEEE USA

Topic: IEEE-USA Supports Public Policy For A Better World 

IEEE-USA supports public policy and career and member services for IEEE members in the USA.  This talk will include a brief discussion on what IEEE-USA does and will focus on its public policy activities to support future technologies, funding of science and technology, immigration policies that support a path to citizenship and support for engineers and technologists.  I will also discuss the impact of the COVID-19 epidemic and what what IEEE and IEEE-USA is doing to help its members as well as society as a whole, to recover from this extraordinary event.  This talk will include discussion of the future of work and the role of technology to enable remote work and new tools to work together in the real world even when we can’t be there physically.


Tom Coughlin, President, Coughlin Associates is a digital storage analyst and business and technology consultant.  He has over 39 years in the data storage industry with engineering and management positions at several companies.  Coughlin Associates consults, publishes books and market and technology reports (including The Media and Entertainment Storage Report and an Emerging Memory Report), and puts on digital storage-oriented events.  He is a regular storage and memory contributor for and M&E organization websites.  He is an IEEE Fellow, Past-President of IEEE-USA and is active with SNIA and SMPTE. For more information on Tom Coughlin and his publications and activities go to

Josephson Arbitrary Waveform Synthesizer as a Quantum Standard of Voltage and Current Harmonics
Jul 9 @ 18:30 – 19:30

Title: Josephson Arbitrary Waveform Synthesizer as a Quantum Standard of Voltage and Current Harmonics

Speaker: Dr. Dimitrios Georgakopoulos, Senior Research Scientist, National Measurement Institute, Sydney, Australia

Date/TimeThursday, July 09, 2020, 6:30 pm – 7:30 p.m. EDT

Abstract: Josephson arbitrary waveform synthesizers (JAWS) are becoming a viable technology for national metrology institutes and industry to establish quantum standards of direct and alternating voltage. At the National Measurement Institute of Australia (NMIA) we have extended the application of the JAWS to provide a standard of both the magnitude and the phase of harmonics in a distorted waveform. Harmonic analysis is critical in a number of industrial applications such as electric power systems, power electronics, characterization of systems and materials and acoustics and vibration. At present, in the calibrations of power analyzers, the traceability of the magnitude of the harmonics is based on ac-dc transfer measurements. However, there is a gap in the traceability of the phase of the harmonics relative to the fundamental. The NMIA calibration system uses a JAWS chip from the National Institute of Standards and Technology (NIST), USA, a precision inductive voltage divider and a set of current shunts designed and manufactured by NMIA. For distorted waveforms with harmonic magnitudes from 5% to 40% of the fundamental, the calibration system can measure odd harmonics up to the 39th with magnitude uncertainties better than 0.001 % of the fundamental for voltage (from 0.01 V to 240 V) and current (from 0.005 A to 20 A) waveforms. The best phase uncertainties range from 0.001° to 0.010° (k = 2.0), depending on the harmonic number and harmonic magnitude. We anticipate that the ability of the JAWS to generate distorted waveforms with the lowest possible uncertainty in the magnitude, and phase spectra will make it a unique tool for low-frequency spectrum analysis.

Speaker’s BioDimitrios Georgakopoulos (IEEE AM’11–M’12–SM’12) was born in Athens, Greece, in 1972. He received his B.Eng. degree in electrical engineering from the Technological Educational Institution of Piraeus, Egaleo, Greece, in 1996; his M.Sc. degree in electronic instrumentation systems from the University of Manchester, Manchester, UK, in 1999; and Ph.D. in electrical engineering and electronics from the University of Manchester Institute of Science and Technology, Manchester, UK, in 2002. From 2002 to 2007, he worked as a research scientist at the National Physical Laboratory, UK. In 2007, he joined the National Measurement Institute, Australia, as a research scientist, where he has been working on the development of quantum voltage standards and low frequency electromagnetic compatibility (EMC) standards. Dr Georgakopoulos is an Associate Editor of the IEEE Transactions on Instrumentation and Measurement, member of the IEEE IMS Measurements in Power Systems Committee (TC‑39), member of the NATA Accreditation Advisory Committee for Calibrations, and member of the American Association for the Advancement of Science (AAAS), USA.

Admission: Free, but registration is required at any additional information, please contact by e-mail: or

Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Sep 16 @ 17:00 – 18:00
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication                Applications

IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:

Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.

Speaker Bio:

Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.

Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.



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