Events

May
14
Thu
Transceiver Architectures for Beyond-5G: Challenges and R&D Opportunities, co-organized with SSC-S
May 14 @ 12:00 – 13:00

Presented by IEEE MTT-S Distinguished Microwave Lecturer (DML) Talks:

Transceiver Architectures for Beyond-5G: Challenges and R&D Opportunities, co-organized with SSC-S

By
Dr. Payam Heydari
University of California, Irvine

Date: Thursday, May 14 , 2020

Time: 12:00 PM – 1 PM

Abstract:

The ongoing super-linear growth of world’s population coupled with the worldwide access to internet and the general public’s tendency to use more bandwidth-intensive applications fuel the urgency to enhance wireless infrastructures so as to meet these demands. Consequently, the wireless R&D is headed towards the inception of “Beyond-5G” (e.g., 6G) technology.  This webinar provides a comprehensive overview of challenges and opportunities in designing beyond-5G transceiver architectures capable of achieving high data rates above and beyond 20 Gbps. 

                                                                 Speaker Bio:

Payam Heydari received his Ph.D. degree from the University of Southern California in 2001. He is currently a Full Professor of Electrical Engineering at the University of California, Irvine. Dr. Heydari’s research covers the design of terahertz/millimeter-wave/RF and analog integrated circuits. He is the (co)-author of two books, one book chapter, and more than 150 journal and conference papers. 

Dr. Heydari is an AdCom member of the IEEE Solid-State Circuits Society. Dr. Heydari currently serves an Associate Editor for the IEEE Journal of Solid-State Circuits and the IEEE Solid-State Circuits Letters. He was a member of the Technical Program Committee of the International Solid-State Circuits Conference (ISSCC). Dr. Heydari is an IEEE Fellow for contributions to silicon-based millimeter-wave integrated circuits and systems.

 

                Event is free, but space is limited.  All participants must register in advance. For                                                  Registration: please use the following link



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