Events

May
2
Thu
The return of the IEEE Ottawa Lunch and Learn @ Mitel HQ
May 2 @ 11:30 – 13:30
The return of the IEEE Ottawa Lunch and Learn @ Mitel HQ | Ottawa | Ontario | Canada

Organized by the IEEE Ottawa Section, IEEE Ottawa Lunch and Learn is an initiative to bridge the gap and derive synergy between Ottawa industry, academia, and government. The initiative, on a monthly basis, brings a speaker from either industry, academia, or government to the heart of the Kanata Tech Hub.

The seminar is accompanied by a complimentary lunch and a space to connect, communicate, and collaborate. Our attendees include members of industry, government, and academia. University and College students are encouraged to attend, network, and discover what’s new and exciting in Ottawa Tech. IEEE Ottawa L&L is FREE and OPEN TO ALL.

Topic:

Perspectives on AI, the future impact on Engineering, Science and Technology

– May 2nd, 2019 –

Robin Grosset

Patent Agent, CTO Mindbridge AI

Artificial Intelligence (AI) is set to disrupt many professions and the future of any role will certainly involve AI. This is true for doctors, lawyers, accounts and even engineers. In this session, we will look at the factors which are bringing about this disruption. We will also explore the importance of explicability and a human-centric approach in AI technology to support improving professional judgement.

 

Robin currently works at MindBridge where he leads the development of a next generation AI Auditor which helps professionals detect and prevent financial anomalies including fraud.

 

Robin has a track record as an entrepreneur having founded successful software start- ups. He joined Cognos and subsequently IBM through acquisitions. In 2012 he was appointed IBM Distinguished Engineer. At IBM, he was a part of the Watson Group where he served as technical lead and chief architect of IBM Watson Analytics. Robin holds many patents in the areas of analytics, data processing and security. MindBridge Ai is a venture-backed FinTech company based in Ottawa, Canada. Through the application of machine learning and artificial intelligence technologies, the MindBridge platform detects anomalous patterns of activities, unintentional errors and intentional misstatements. Using MindBridge Ai Auditor, organizations across multiple industries can minimize financial loss, reduce corporate liability and can focus on providing higher value services to their clients.

Jun
20
Thu
Ottawa IEEE Lunch and Learn on state of the Canadian Internet @ CENGN (Center for Next Generation Networks)
Jun 20 @ 11:30 – 13:00

Status of the Internet in Canada and the importance of Canadian IXP’s

Jacques Latour

Chief Technology Officer, CIRA/.CA

A quick overview of the Canadian Internet exchange landscape from coast to coast to coast. Canada has its share of challenges and opportunities in building and growing the IXP infrastructure near the Canadian border, and also to support the need of the rural communities.

As an expert in developing innovative, leading-edge IT solutions, Jacques has established CIRA as a global leader among ccTLD registries. He has 25+ years of experience in the private and not-for-profit sectors and as CIRA’s CTO,is currently leading CIRA Labs, CIRA’s innovation hub and providing leadership and direction for the management and security of the .CA registry and its underlying DNS.

A visionary in the Internet community, Jacques led the development of CIRA’s Internet Performance Test, is an outspoken advocate for the adoption of IPv6 and represents the .CA registry internationally as a member of a variety of working groups and advisory groups, including being a member of ICANN’s Security and Stability Advisory Committee (SSAC), TLDOPS standing committees and TechDay and DNSSEC Planning Program Committee.

Jacques is committed to the development of a new Canadian Internet architecture. He has served as the catalyst for the creation of a national Canadian IXP association, CA-IX, and is a member of the Manitoba Internet Exchange’s (MBIX) and the DNS-OARC Board of Directors.

Jacques holds an Electronics Engineering Technologist diploma from Algonquin College in Ottawa, is ITIL v3 Foundation certified and is a certified Agile ScrumMaster.

Agenda

11:30 – 12:00  Lite Lunch, Networking, and Welcoming Remarks
12:00 – 13:00  Seminar

Distinguished Lecture by Professor Mohamed-Slim Alouini “Smart Villages: When Connectivity Meets Affordability” @ Carleton University, ME4463
Jun 20 @ 13:00 – 14:00
Distinguished Lecture by Professor Mohamed-Slim Alouini "Smart Villages: When Connectivity Meets Affordability" @ Carleton University, ME4463   | Ottawa | Ontario | Canada

The role of Internet and Communication Technology (ICT) in
bringing about a revolution in almost all aspects of human life needs no
introduction. It is indeed a well-known fact that the transmission of
information at a rapid pace has transformed all spheres of human life such as
education, health, and economy to name a few. In addition, with the advent in
Electronics and Photonics Technology (EPT), we have observed sustained growth
and expansion in computation and display technology. From user demography
perspective, urbanized population are the major beneficiary of such advances.
Therefore, the benefits of ICT and EPT are yet to be experienced by almost 4
billion people in the world who are still “unconnected or under-connected” and
suffer as such from the “digital divide,” a term coined in order to emphasize
the lack of ICT infrastructure in many parts of the world.

Major challenges for widespread adoption of ICT and EPT in
these areas are related to cost, lack of power supply, and complexities
associated with learning and usage. However, if we can categorically overcome
these challenges, then these technologies can be used for food, water, shelter,
energy, environment, education, healthcare, and security. In addition, the
wide-spread availability of these technologies, will lead to smart suburbs,
smart towns, smart villages, etc., without the need to necessarily live in
smart cities. This would reverse the trend and allow a more sustainable world
with a more balanced distribution of the population density. In this context,
this talk will present recently proposed solutions to provide high speed
connectivity in rural areas along progress in affordable electronics to serve
and contribute to the development of far-flung regions.

In particular, new solutions for both: (i) integrated
satellite-airborne-ground networks providing global coverage and connectivity
and (ii) terrestrial mesh/multi-hop directive networks connecting underserved
areas will be discussed.

Moreover, some examples of democratized wearable
electronics using Do-It-Yourself (DIY) assembly of paper along Android DIY
applications capturing and displaying vital health signs over connected
smartphones for real-time diagnosis will be presented.

Jul
17
Wed
An Evening with Power Integrity Experts @ Fidus Systems, Ottawa
Jul 17 @ 17:00 – 19:30

Speaker 1: Hisham Abed, P.Eng., Ericsson

Topic: Power Integrity – Best design practices

Speaker 2: Dr. Ihsan Erdin, Celestica

Topic: Power Integrity Optimization amidst MLCC shortage

Parking: Free

Registration:  Free, and is on a first to reply basis. Preference given to IEEE EMC and CPMT society members. Seating is limited. E-mail reservation is required.

Pizza and soft drinks will be served.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa
EMC chapter

Syed.Bokhari@fidus.com,

Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

 

Directions:    www.fidus.com

Sep
16
Wed
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Sep 16 @ 17:00 – 18:00
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication                Applications

IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:

Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.

Speaker Bio:

Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.

Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.

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