Innovation enables organizations to open new avenues of product differentiation by customizing products. In today’s rapidly changing business environment, engineers must innovate quickly to incorporate new features while reducing development costs and delivering new products to the market before the competition. Simulation plays a key role in helping engineers drive innovation, enabling complete virtual prototypes of complex systems to be validated across all physics and engineering disciplines.
Join us as we return to Ottawa for our 4th Annual ANSYS Innovation Conference on May 8, 2019! This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.
What You Will Learn
- Experience new simulation capabilities that provide unprecedented design insight as they speed your time to market
- Incorporate various productivity enhancement tools and techniques into your engineering department’s workflow
- Gain insights into 5G system development with physics-based simulation and cover critical design issues, such as antenna performance, semiconductor reliability, and thermal integrity
- Identify signal integrity issues early in the design cycle for electronics IC packages, PCBs, connectors and other complex interconnects
- Modify antenna design, predict antenna efficiency and the overall thermal and EM performance of the product based on electromagnetic and thermal coupling solutions
Presented by IEEE MTT-S Distinguished Microwave Lecturer (DML) Talks:
Transceiver Architectures for Beyond-5G: Challenges and R&D Opportunities, co-organized with SSC-S
Dr. Payam Heydari
University of California, Irvine
Date: Thursday, May 14 , 2020
Time: 12:00 PM – 1 PM
The ongoing super-linear growth of world’s population coupled with the worldwide access to internet and the general public’s tendency to use more bandwidth-intensive applications fuel the urgency to enhance wireless infrastructures so as to meet these demands. Consequently, the wireless R&D is headed towards the inception of “Beyond-5G” (e.g., 6G) technology. This webinar provides a comprehensive overview of challenges and opportunities in designing beyond-5G transceiver architectures capable of achieving high data rates above and beyond 20 Gbps.
Payam Heydari received his Ph.D. degree from the University of Southern California in 2001. He is currently a Full Professor of Electrical Engineering at the University of California, Irvine. Dr. Heydari’s research covers the design of terahertz/millimeter-wave/RF and analog integrated circuits. He is the (co)-author of two books, one book chapter, and more than 150 journal and conference papers.
Dr. Heydari is an AdCom member of the IEEE Solid-State Circuits Society. Dr. Heydari currently serves an Associate Editor for the IEEE Journal of Solid-State Circuits and the IEEE Solid-State Circuits Letters. He was a member of the Technical Program Committee of the International Solid-State Circuits Conference (ISSCC). Dr. Heydari is an IEEE Fellow for contributions to silicon-based millimeter-wave integrated circuits and systems.
Event is free, but space is limited. All participants must register in advance. For Registration: please use the following link
Presented by the IEEE Ottawa Section MTT-S/AP-S Chapter & Young Professionals
Accelerating 5G Design Innovation Through Simulation
Dr. Laila Salman
Date: Wednesday, June 10, 2020
Time: 2:30 PM – 4:00 PM
5G connectivity is the next technological revolution. This pervasive, ultrafast compute network will connect billions of devices with data on-demand. It will drive economic expansion in many sectors, spawn new products and services, and transform our lives as we know it. Yet, before 5G can deliver on its promises and quality of service (QoS) metrics, wireless systems designers and engineers must overcome sizable challenges.
Ansys 5G simulation solutions empower these individuals to solve the complexities impeding device, network and data center design. Ansys 5G simulation solutions provide electromagnetics, semiconductor, electronics cooling and mechanical analysis tools to accurately simulate 5G radio and related technologies. The multi-solution platform leverages high-performance computing that can be deployed across the enterprise, allowing designers and engineering experts to collaborate more effectively.
This seminar will highlight the following 5G engineering challenges:
· End User Equipment
o multi-frequency band antenna integration
o modeling of mm-wave array antennas
o RFI, EMI & Desense Mitigation
· Base-Station Antenna Modeling
o Full Communication Analysis in Electrically Large & Complex Environment
o RFI, Data Coverage & ElectroThermal Reliability
Dr. Laila Salman received the B.S. and M.S. degrees in electronics and communication engineering from Cairo University, Egypt, and the PhD. Degree in electromagnetic and antenna design from the University of Mississippi. She also worked as a post-doctoral student at the Université de Quebec en Outaouais, Gatineau, Canada till 2010. Her research was on dielectric resonator antennas, wearable antennas, microwave and millimeter-wave circuits and systems, microwave imaging for early detection of breast cancer and scattering from left-handed metamaterials. Dr. Salman joined Ansys Canada Ltd. in August 2010 as a Lead Technical Services Specialist for High Frequency Applications.
Registration: Please use the link in the registration section to sign up for the event.
To join event use the following link.