Events

Aug
12
Wed
IEEE OTTAWA WEBINAR SERIES ON AI AND MACHINE LEARNING
Aug 12 @ 12:00 – 13:00

Speaker:                Dr : Marin Soljacic, MIT

Date:                      Wednesday
Aug 12th, 2020

Time:                      12:00
noon to 13:00

Title of the talk:       Photonics:
a great testing-ground to develop new AI algorithms for science

The Smart City Building Blocks & Their Synergy with Smart Villages
Aug 12 @ 18:30 – 19:30
The Smart City Building Blocks & Their Synergy with Smart Villages

ADMISSION: Free, but the registration in advance is required.

REGISTRATIONhttps://events.vtools.ieee.org/m/236964.

Abstract – A smart city relies on widely distributed smart devices to monitor the urban environment in real-time, collects information for intelligent decision making, and facilitates various services to improve the quality of urban living. The distributed network of intelligent sensor nodes, as well as data centers/clouds where sensor data are stored and shared, constitutes a smart city infrastructure. Smart cities address urban challenges such as pollution, energy efficiency, security, parking, traffic, transportation, and others by utilizing advanced technologies in data gathering and communications interconnectivity via the Internet. It provides real time and remote monitoring for different aspects of data management in areas such as transportation, communication, video surveillance, and sensors distributed throughout the city. Simultaneously, the Smart City building blocks like education, telemedicine, health care, IT applications, pollution management, etc. can be deployed in the IEEE Smart Village initiative to have a greater impact on the rural population throughout the world. through reliable electricity and internet connectivity.

Speaker Bio – Prof. Dr. Saifur Rahman is the founding director of the Advanced Research Institute (www.ari.vt.edu) at Virginia Tech, USA, where he is the Joseph R. Loring Professor of Electrical and Computer Engineering. He also directs the Center for Energy and the Global Environment (www.ceage.vt.edu). He is a Life Fellow of the IEEE and an IEEE Millennium Medal winner. He was the founding Editor-in-Chief of the IEEE Electrification Magazine and the IEEE Transactions on Sustainable Energy. In 2006, he served on the IEEE Board of Directors as the Vice President for Publications. He is a Distinguished Lecturer for the IEEE Power & Energy Society (PES) and has lectured on renewable energy, energy efficiency, smart grid, electric power system operation and planning, etc. in over 30 countries. He was IEEE Power and Energy Society President 2018-2019 and is now a candidate for IEEE President-Elect 2021.

He chaired the US National Science Foundation Advisory Committee for International Science and Engineering, 2010-2013. He conducted several energy efficiency projects for Duke Energy, Tokyo Electric Power Company, US National Science Foundation, US Department of Defense, State of Virginia and US Department of Energy.

For any additional information, please contact: ajit.pardasani@ieee.org or branislav@ieee.org

Sep
2
Wed
Characterization and Modeling of GaN HEMT Trapping Effects for Microwave Circuit Design
Sep 2 @ 11:00 – 12:00

 

IEEE Ottawa Section: MTT-S / AP-S Chapter presents:

Title: Characterization and Modeling of GaN HEMT Trapping Effects for Microwave Circuit Design

Date: September 2nd, 2020

Time: 11 AM (ET)

Register at: https://events.vtools.ieee.org/m/238482

This talk will review some recent advancements achieved on the characterization and modelling of the trapping effects felt in GaN HEMT transistors, and their impact on microwave circuit design. Because of their nowadays importance, a particular attention will be payed to applications on high power amplifiers for mobile wireless infrastructure and pulsed radar applications.

For that, the talk will start by recollecting the most common model formulations adopted for the various levels of RF engineering, from the device level (physics) to the transistor (circuit) and amplifier (system) level. Starting by the Shockley-Read-Hall capture and emission processes we will be able to understand one of the fundamental signatures of trapping effects, the significantly different charge and discharging time constants, and its impact on power amplifier nonlinear distortion behavior. Then, some widely adopted approaches of the channel current transients’ characterization are addressed and the talk concludes by presenting some illustrative cases of application to RF high power amplifiers.

Speaker: Jose C. Pedro

José C. Pedro received the Diploma, Ph.D., and Habilitation degrees in electronics and telecommunications engineering from the Universidade de Aveiro, Aveiro, Portugal, in 1985, 1993, and 2002, respectively.

He is currently a Full Professor with the Universidade de Aveiro and head of the Aveiro site of the Instituto de Telecomunicações. He has authored 2 books and authored or co-authored more than 200 papers in international journals and symposia. His current research interests include active device modelling and the analysis and design of various nonlinear microwave circuits.

Dr. Pedro was a recipient of various prizes including the 1993 Marconi Young Scientist Award, the 2000 Institution of Electrical Engineers Measurement Prize, the 2015 EuMC Best Paper Microwave Prize, and the Microwave Distinguished Educator Award. He has served the scientific community as a Reviewer and an Editor for several conferences and journals, namely, the IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, for which he was the Editor-in-Chief.

Sep
16
Wed
A Brief Introduction to IEEEXtreme and WIE HACK613
Sep 16 @ 17:00 – 18:00
A Brief Introduction to IEEEXtreme and WIE HACK613

Venue: Online

Registration: https://www.eventbrite.ca/e/a-brief-introduction-to-ieeextreme-and-wie-hack613-tickets-119203981317

Event Contact Name Ragunath Anbarasu

Event Contact Email: https://wie.ieeeottawa.ca/contact-us/

IEEEXtreme is a worldwide Annual Hackathon, in which teams of IEEE student members participate against each other in a span of 24 hours to solve a set of programming problems. This year IEEEXtreme 14.0 is being held on October 24th. Ragunath Anbarasu, the web master and an active volunteer of IEEE WIE Ottawa has been selected as the Ambassador and Section Lead for the Ottawa region. In this session, he will walk through the IEEEXtreme competition and WIE HACK613, a mock hackathon IEEE WIE Ottawa is organizing as a practice for IEEEXtreme. Register Now! And learn more about the event!

Bio: Ragunath Anbarasu is currently doing his Masters in Electrical and Computer Engineering with Specialization in Data Science at Carleton University. He as been the Web Master of IEEE WIE Ottawa for almost a year and is extremely active in volunteering activities related to IEEE. He has been coordinating with the organizers in hosting this years IEEEXtreme Programming Competition in their respective student branches and supporting Non-IEEE Student Branch Members to get exposure to the Hackathon. He will be extending his help to students looking for support and guidance with information related to IEEEXtreme and connect them to a professional member.

Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Sep 16 @ 17:00 – 18:00
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication                Applications

IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:

Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Syed.Bokhari@fidus.com,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.

Speaker Bio:

Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.

Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.

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