Characterization and Modeling of GaN HEMT Trapping Effects for Microwave Circuit Design
Sep 2 @ 11:00 – 12:00


IEEE Ottawa Section: MTT-S / AP-S Chapter presents:

Title: Characterization and Modeling of GaN HEMT Trapping Effects for Microwave Circuit Design

Date: September 2nd, 2020

Time: 11 AM (ET)

Register at:

This talk will review some recent advancements achieved on the characterization and modelling of the trapping effects felt in GaN HEMT transistors, and their impact on microwave circuit design. Because of their nowadays importance, a particular attention will be payed to applications on high power amplifiers for mobile wireless infrastructure and pulsed radar applications.

For that, the talk will start by recollecting the most common model formulations adopted for the various levels of RF engineering, from the device level (physics) to the transistor (circuit) and amplifier (system) level. Starting by the Shockley-Read-Hall capture and emission processes we will be able to understand one of the fundamental signatures of trapping effects, the significantly different charge and discharging time constants, and its impact on power amplifier nonlinear distortion behavior. Then, some widely adopted approaches of the channel current transients’ characterization are addressed and the talk concludes by presenting some illustrative cases of application to RF high power amplifiers.

Speaker: Jose C. Pedro

José C. Pedro received the Diploma, Ph.D., and Habilitation degrees in electronics and telecommunications engineering from the Universidade de Aveiro, Aveiro, Portugal, in 1985, 1993, and 2002, respectively.

He is currently a Full Professor with the Universidade de Aveiro and head of the Aveiro site of the Instituto de Telecomunicações. He has authored 2 books and authored or co-authored more than 200 papers in international journals and symposia. His current research interests include active device modelling and the analysis and design of various nonlinear microwave circuits.

Dr. Pedro was a recipient of various prizes including the 1993 Marconi Young Scientist Award, the 2000 Institution of Electrical Engineers Measurement Prize, the 2015 EuMC Best Paper Microwave Prize, and the Microwave Distinguished Educator Award. He has served the scientific community as a Reviewer and an Editor for several conferences and journals, namely, the IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, for which he was the Editor-in-Chief.

A Brief Introduction to IEEEXtreme and WIE HACK613
Sep 16 @ 17:00 – 18:00
A Brief Introduction to IEEEXtreme and WIE HACK613

Venue: Online


Event Contact Name Ragunath Anbarasu

Event Contact Email:

IEEEXtreme is a worldwide Annual Hackathon, in which teams of IEEE student members participate against each other in a span of 24 hours to solve a set of programming problems. This year IEEEXtreme 14.0 is being held on October 24th. Ragunath Anbarasu, the web master and an active volunteer of IEEE WIE Ottawa has been selected as the Ambassador and Section Lead for the Ottawa region. In this session, he will walk through the IEEEXtreme competition and WIE HACK613, a mock hackathon IEEE WIE Ottawa is organizing as a practice for IEEEXtreme. Register Now! And learn more about the event!

Bio: Ragunath Anbarasu is currently doing his Masters in Electrical and Computer Engineering with Specialization in Data Science at Carleton University. He as been the Web Master of IEEE WIE Ottawa for almost a year and is extremely active in volunteering activities related to IEEE. He has been coordinating with the organizers in hosting this years IEEEXtreme Programming Competition in their respective student branches and supporting Non-IEEE Student Branch Members to get exposure to the Hackathon. He will be extending his help to students looking for support and guidance with information related to IEEEXtreme and connect them to a professional member.

Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Sep 16 @ 17:00 – 18:00
Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication                Applications

IEEE Distinguished Lecturer Presentation hosted jointly by the OTTAWA EMC/CPMT/ED/CAS/SSCS/AP/MTT Chapters:

Speaker : Dr. Xiaoxiong Gu, IBM T.J. Watson Research Center, NY
Topic : Opportunities, Challenges and Implementation of Silicon Integration and Packaging in mmWave Radar and Communication Applications
Date : Wednesday September 16, 2020
Time : 5:00 PM to 6:00 PM EST
Location : Online via ZOOM
Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC CPMT/ED/CAS/SSCS/APS/MTT society members. E-mail Reservation is required.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter,
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

Abstract: Co-design and integration of RFIC, package, and antennas are critical to enable multiple aspects of 5G communications (backhaul, last mile, mobile access) and are particularly challenging at mmWave frequencies. This talk will cover various important aspects of mmWave antenna module packaging and integration for base station, backhaul, and user equipment applications, respectively, with particular emphasis on signal, power and EMC integrity. We will first present a historical perspective on Si-based mmWave modules and approaches for antenna and IC integration including trade-offs. We will focus on the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Second, we will present a W-band phased-array module with 64-element dual-polarization antennas for radar imaging and backhaul application. The module consists of a multilayer
organic chip-carrier package and a 16-element phased-array TX IC or a 32- element RX IC chipset. Third, we will describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating four antennas that support both normal and end-fire directions for a wide link spatial coverage. Detailed signal, power and EMC modeling and analysis of the modules and the system are presented.

Speaker Bio:

Xiaoxiong Gu received the Ph.D. in electrical engineering from the University of Washington, Seattle, USA, in 2006. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication, imaging radar and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including Ka-band, V-band and Wband phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including onchip and off-chip interconnects. He has been involved in developing novel TSV
and interposer technologies for heterogeneous system integration.

Dr. Gu has authored over 90 peer-reviewed publications, 2 book chapters and holds 9 issued patents. He was a co-recipient of IEEE ISSCC 2017 Lewis Winner Award for Outstanding Paper and IEEE JSSC 2017 Best Paper Award (the world’s first reported silicon-based 5G mmWave phased array antenna module operating at 28GHz). He was a co-recipient of the 2017 Pat Goldberg Memorial Award to
the best paper in computer science, electrical engineering, and mathematics published by IBM Research. He received IBM Outstanding Research Accomplishment in 2019 and Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and
2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on different
program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon. Dr. Gu was the General Chair of IEEE EPEPS 2018 in San Jose, CA. He is also a Distinguished Lecturer for IEEE EMC Society in 2019-2020 and is currently an Associate Editor for IEEE Transactions on Component, Packaging and Manufacturing Technology.

IEEE Canada Technology Leadership Monthly Webinar
Sep 24 @ 14:00 – 15:00

Date: Sept 24th, 2020

Time: 02:00 PM to 03:00 PM EDT

Speaker: Ken Coates, Professor, University of Saskatchewan

Topic: Technology-Enabled Indigenous and Remote Communities



As the COVID-19 Pandemic demonstrated, almost all Indigenous and remote communities suffered from serious infrastructure deficits.  With limited or unreliable Internet, poor quality electricity, and weak health care services, these communities were uniquely vulnerable to the disease and the economic and social challenges that accompanied the pandemic.  But Canadians already knew that Indigenous and remote communities are poorly served and largely lift out of the so-called “innovation economy.”  It is time to develop a strategy for bringing technology-enabled opportunities to Indigenous and remote communities.  This webinar presents a model for digitally-enabled Indigenous and remote communities, explores the barriers to implementing this “inversion” of Canadian innovation and that contemplates strategies for addressing quality of life issues in collaboration with residents and local governments.


Ken Coates is Canada Research Chair in Regional Innovation at the Johnson-Shoyama Graduate School of Public Policy, University of Saskatchewan. His work focuses on the development of strategies to promote 21st century well-being in small town, rural, Indigenous and remote Canada. Ken’s major project examines the potential contributions — and negative impacts — of emerging technologies on rural and remote communities.

For more information and speaking opportunity, please contact, Dr Kexing Liu, IEEE Canada Outreach and Partnership Committee Chair,

WIE HACK613: The Ottawa Hackathon
Sep 26 @ 14:00 – 17:00


Date and Place: The event will be held online on September 26th and 27th, 2020.

“Every accomplishment starts with the decision to try” ~ John F. Kennedy

New to Hackathons? Are you also interested in participating in IEEEXtreme 14.0? IEEE WIE Ottawa presents the first ever Mock Hackathon in Ottawa! Win Exciting Prizes and get experience with us. No need to think of an idea! The questions will be given to you. Our mentors will further help you to get a head start in your hackathon journey! This is a practice event just for you! Learn more about IEEEXtreme here->

September 26th and 27th, 2020

The event is fully online including the mentorship*.

September 26th, 2020
01:00 PM The opening ceremony

02:00 PM Commencement of Hackathon

05:00 PM Final Submission

September 27th, 2020
01:00 PM Results declaration webinar

01:30 PM Prize announcement

02:00 PM The closing ceremony

For More Details Visit:



Join IEEE or a Society

Member Services

IEEE Ottawa Section Logo

© Copyright 2020 IEEE – All rights reserved. Use of this website signifies your agreement to the IEEE Terms and Conditions.

A not-for-profit organization, IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity.