Innovation enables organizations to open new avenues of product differentiation by customizing products. In todayâ€™s rapidly changing business environment, engineers must innovate quickly to incorporate new features while reducing development costs and delivering new products to the market before the competition. Simulation plays a key role in helping engineers drive innovation, enabling complete virtual prototypes of complex systems to be validated across all physics and engineering disciplines.
Join us as we return to Ottawa for our 4th Annual ANSYS Innovation Conference on May 8, 2019! This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.
What You Will Learn
- Experience new simulation capabilities that provide unprecedented design insight as they speed your time to market
- Incorporate various productivity enhancement tools and techniques into your engineering departmentâ€™s workflow
- Gain insights into 5G system development with physics-based simulation and cover critical design issues, such as antenna performance, semiconductor reliability, and thermal integrity
- Identify signal integrity issues early in the design cycle for electronics IC packages, PCBs, connectors and other complex interconnects
- Modify antenna design, predict antenna efficiency and the overall thermal and EM performance of the product based on electromagnetic and thermal coupling solutions
The inaugural OSDforum will take place in Ottawa this September 18. It is of interest to System architects, software designers, hardware designers and researchers from government, industry and academia.
RISC-V is the 5th generation of the Reduced Instruction Set Computer (RISC-V) Instruction-Set Architecture (ISA), the OpenHW Group is a not-for-profit global organisation aiming to boost the adoption of open-source processors by providing a platform for collaboration, creating a focal point for ecosystem development, and offering open-source IP for processor cores.
Don’t miss out the opportunity to join this exciting new development platform and get your own RISC-V development board to keep. All this while learning from leading industry and academic experts focused on IoT, Edge and Machine Learning development that leverage open source SW and HW.
Space is limited and we have all indications that the event will sell out. Register today.
Technological Stewardship is a new concept intended to focus on the promise of technology to create a better future for society today and avoid the negative consequences. While Technologies have the promise to address key issues and create a better future, new developments often amplify inequities and create new kinds of risk. What does this mean for how to move
Through this interactive 2-hour workshop, you will learn about Technological Stewardship and develop your ability to ensure technology makes the world a better place for all. You will also be introduced to a powerful tool for practically integrating these concepts into the product design/development process.
Mark Abbott is the Executive Director of the Engineering Change Lab, which serves as a catalyst for evolving the engineering community to reach its full potential as stewards of technology for the benefit of humanity.Â Over the past 5 years, over 125 organizations and 350+ individual leaders (CEOs, VPs, Deans, Directors) have collaborated using the Lab’s platform advancing understanding and action to evolve engineering. Previously, Mark served as member of the Executive Team at Engineers without borders for several years.
This interactive workshop is limited to 45 attendees so as to create an optimal interactive and learning environment.Â This series of workshops is planned to have subsequent workshops taking place in March and April.Â We are especially interested in professionals willing to tryout the powerful tools and providing feedback on integrating the concepts into the product design / development process.
IEEE Ottawa Seminar Series on AI and Machine Learning
IEEE Ottawa Section, PHO Chapter,
CS Chapter, SP Chapter, TEMS Chapter
Jointly with Vitesse
The Rise & Foreseeable Future of
Observations from a Commercial Pioneer
Wednesday, March 18, 2020
359 Terry Fox Drive, Suite 200, Kanata, Ontario
11:30 â€“ 13:30
Artificial Intelligence (AI) is constantly in the news
with stories of promise and peril.
Political leaders have declared it a national priority, the global high
tech industry is racing AI apps to markets and policy and governance
implications of AI are in their infancy.
We will explore where this is all heading.
We will begin with some definitions and a bit of
history behind the rise of AI.Â The talk
will then place AI in the context of being a potentially disruptive technology
on society. This will lead to a discussion about ethics and moral issues
regarding the development and use of aspects of AI as a dual-use
technology.Â Time permitting, the role of
AI in defence and security will be used as an example for appreciating the
complexity and ethical issues brought on by AI. We will then turn to the role
of the engineer in this new world being enabled by AI.
Finally, we will review potential governance and
policy issues and options to address the rapid unchecked development and
application of AI within society at large; and, ultimately end with a
The speaker was
a pioneer in the commercialization of AI in the 1980s and today is actively
involved in ethical and policy issues related to AI.Â Peter has an extensive background on the
forefront of scientific and technological breakthroughs around disruptive
technologies and their impacts on society.
He was an early proponent in the development and promotion of Big Data
and data analytics using High Performance Computers, and was a major
contributor in creating the Internet in Canada, among other accomplishments.
Peter has a
background as a scientist, business manager, entrepreneur, domestic and
international bureaucrat, executive, diplomat, management advisor, and
academic; including most recently affiliation with both Telfer School of
Management and the Faculty of Engineering at the University of Ottawa and the
Faculty of Engineering at Carleton University.
Peter also blogs on AI for the Institute on Science, Society and Policy,
an interfaculty organisation at uOttawa.
is free, but space is limited.Â All
participants must register in advance.Â Â
follow the link to register
more information, please contact: Kexing Liu email@example.com
Presented by IEEE MTT-S Distinguished Microwave Lecturer (DML) Talks:
Transceiver Architectures for Beyond-5G: Challenges and R&D Opportunities, co-organized with SSC-S
Dr. Payam Heydari
University of California, Irvine
Date: Thursday, May 14 , 2020
Time: 12:00 PMÂ – 1 PM
The ongoing super-linear growth of worldâ€™s population coupled with the worldwide access to internet and the general publicâ€™s tendency to use more bandwidth-intensive applications fuel the urgency to enhance wireless infrastructures so as to meet these demands. Consequently, the wireless R&D is headed towards the inception of “Beyond-5G” (e.g., 6G) technology.Â This webinar provides a comprehensive overview of challenges and opportunities in designing beyond-5G transceiver architectures capable of achieving high data rates above and beyond 20 Gbps.Â
Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Speaker Bio:
Payam Heydari received his Ph.D. degree from the University of Southern California in 2001. He is currently a Full Professor of Electrical Engineering at the University of California, Irvine. Dr. Heydari’s research covers the design of terahertz/millimeter-wave/RF and analog integrated circuits. He is the (co)-author of two books, one book chapter, and more than 150 journal and conference papers.Â
Dr. Heydari is an AdCom member of the IEEE Solid-State Circuits Society. Dr. Heydari currently serves an Associate Editor for the IEEE Journal of Solid-State Circuits and the IEEE Solid-State Circuits Letters. He was a member of the Technical Program Committee of the International Solid-State Circuits Conference (ISSCC). Dr. Heydari is an IEEE Fellow for contributions to silicon-based millimeter-wave integrated circuits and systems.
Â Â Â Â Â Â Â Â Event is free, but space is limited. Â All participants must register in advance. ForÂ Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Registration: please use the following link