Events

May
2
Thu
The return of the IEEE Ottawa Lunch and Learn @ Mitel HQ
May 2 @ 11:30 – 13:30
The return of the IEEE Ottawa Lunch and Learn @ Mitel HQ | Ottawa | Ontario | Canada

Organized by the IEEE Ottawa Section, IEEE Ottawa Lunch and Learn is an initiative to bridge the gap and derive synergy between Ottawa industry, academia, and government. The initiative, on a monthly basis, brings a speaker from either industry, academia, or government to the heart of the Kanata Tech Hub.

The seminar is accompanied by a complimentary lunch and a space to connect, communicate, and collaborate. Our attendees include members of industry, government, and academia. University and College students are encouraged to attend, network, and discover what’s new and exciting in Ottawa Tech. IEEE Ottawa L&L is FREE and OPEN TO ALL.

Topic:

Perspectives on AI, the future impact on Engineering, Science and Technology

– May 2nd, 2019 –

Robin Grosset

Patent Agent, CTO Mindbridge AI

Artificial Intelligence (AI) is set to disrupt many professions and the future of any role will certainly involve AI. This is true for doctors, lawyers, accounts and even engineers. In this session, we will look at the factors which are bringing about this disruption. We will also explore the importance of explicability and a human-centric approach in AI technology to support improving professional judgement.

 

Robin currently works at MindBridge where he leads the development of a next generation AI Auditor which helps professionals detect and prevent financial anomalies including fraud.

 

Robin has a track record as an entrepreneur having founded successful software start- ups. He joined Cognos and subsequently IBM through acquisitions. In 2012 he was appointed IBM Distinguished Engineer. At IBM, he was a part of the Watson Group where he served as technical lead and chief architect of IBM Watson Analytics. Robin holds many patents in the areas of analytics, data processing and security. MindBridge Ai is a venture-backed FinTech company based in Ottawa, Canada. Through the application of machine learning and artificial intelligence technologies, the MindBridge platform detects anomalous patterns of activities, unintentional errors and intentional misstatements. Using MindBridge Ai Auditor, organizations across multiple industries can minimize financial loss, reduce corporate liability and can focus on providing higher value services to their clients.

May
8
Wed
4th Annual ANSYS Innovation Conference @ Brook Street Hotel
May 8 @ 09:00 – 15:00
4th Annual ANSYS Innovation Conference @ Brook Street Hotel | Ottawa | Ontario | Canada

Innovation enables organizations to open new avenues of product differentiation by customizing products. In today’s rapidly changing business environment, engineers must innovate quickly to incorporate new features while reducing development costs and delivering new products to the market before the competition. Simulation plays a key role in helping engineers drive innovation, enabling complete virtual prototypes of complex systems to be validated across all physics and engineering disciplines.

Join us as we return to Ottawa for our 4th Annual ANSYS Innovation Conference on May 8, 2019! This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.

View Agenda

What You Will Learn

  • Experience new simulation capabilities that provide unprecedented design insight as they speed your time to market
  • Incorporate various productivity enhancement tools and techniques into your engineering department’s workflow
  • Gain insights into 5G system development with physics-based simulation and cover critical design issues, such as antenna performance, semiconductor reliability, and thermal integrity
  • Identify signal integrity issues early in the design cycle for electronics IC packages, PCBs, connectors and other complex interconnects
  • Modify antenna design, predict antenna efficiency and the overall thermal and EM performance of the product based on electromagnetic and thermal coupling solutions

 

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