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Automotive EMC

Mr. Mark Steffka

General Motors’ Power Train Electromagnetic Compatibility (EMC) Department

Date     :   Tuesday June 29, 2010

Time     :   6:00 PM  to 8:00 PM

Location :   FIDUS SYSTEMS Inc., 900 Morrison Drive, Suite 203,Ottawa, Ontario, K2H 8K7 Direction 


This presentation covers EMC engineering approaches as applied to automotive systems, from the conventional “legacy” systems to the latest developments in vehicle propulsion, including the system architecture and EMC aspects of today’s hybrid/electric vehicles. There is discussion about the unique electromagnetic environment that automotive systems are required function in as well an overview of the some of the EMC test methods that are used for automotive components, systems, and “vehicle level”. Typical automotive.


http://www.emc2010.org/assets/images/Bio%20Images/Steffka.jpg Mr. Mark Steffka received the B.S. degree in electrical engineering from the University of Michigan in 1981, and a M.S. from Indiana Wesleyan University in 1987.  He has almost 30 years of experience in the design and development of military, aerospace, and automotive electronics systems.  He is currently with General Motors’ Powertrain Electromagnetic Compatibility (EMC) department and is involved in the EMC engineering of hybrid, electric, and fuel cell vehicles.  In 2000, he was appointed as a Lecturer at the University of Michigan-Dearborn and in 2006, was also appointed as an Adjunct Professor at the University of Detroit – Mercy.  He regularly teaches at both universities with courses on EMC, antennas, and electronic communication systems. He is the author and/or co-author of many publications on EMC, RFI, including the book Automotive Electromagnetic Compatibility (2004), and his paper to the Society of Automotive Engineers (SAE) Congress on “Engine Component Effects of Spark-Ignition Caused Radio Frequency Engineering (RFI)” was “Judged (by SAE) to be among the most outstanding SAE technical papers of 2007”.  He is an IEEE member and his professional activities include serving as a technical session chair for SAE and IEEE conferences, were the Technical Program Co-Chair for the 2008 IEEE International Symposium on EMC, and have been an instructor the symposium’s “Global EMC University”.  He has also been an invited speaker at IEEE and SAE conferences held in the United States and international