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Automotive
EMC
Mr.
Mark Steffka
General Motors’ Power Train Electromagnetic Compatibility (EMC)
Department
Date : Tuesday June 29, 2010
Time : 6:00 PM to 8:00 PM
Location :
FIDUS SYSTEMS Inc., 900 Morrison Drive, Suite 203,Ottawa, Ontario, K2H
8K7 Direction
Abstract:
This presentation
covers EMC engineering approaches as applied to automotive systems, from the
conventional “legacy” systems to the latest developments in
vehicle propulsion, including the system architecture and EMC aspects of
today’s hybrid/electric vehicles. There is discussion about the unique
electromagnetic environment that automotive systems are required function in
as well an overview of the some of the EMC test methods that are used for
automotive components, systems, and “vehicle level”. Typical
automotive.
Bio:
 Mr.
Mark Steffka received the B.S. degree in electrical
engineering from the University of Michigan in 1981, and a M.S. from Indiana
Wesleyan University in 1987. He
has almost 30 years of experience in the design and development of military,
aerospace, and automotive electronics systems. He is currently with General
Motors’ Powertrain Electromagnetic
Compatibility (EMC) department and is involved in the EMC engineering of
hybrid, electric, and fuel cell vehicles. In 2000, he was appointed as a Lecturer
at the University of Michigan-Dearborn and in 2006, was also appointed as an
Adjunct Professor at the University of Detroit – Mercy. He regularly teaches at both
universities with courses on EMC, antennas, and electronic communication
systems. He is the author and/or co-author of many publications on EMC, RFI,
including the book Automotive Electromagnetic Compatibility (2004), and his
paper to the Society of Automotive Engineers (SAE) Congress on “Engine
Component Effects of Spark-Ignition Caused Radio Frequency Engineering
(RFI)” was “Judged (by SAE) to be among the most outstanding SAE
technical papers of 2007”.
He is an IEEE member and his professional activities include serving
as a technical session chair for SAE and IEEE conferences, were the Technical
Program Co-Chair for the 2008 IEEE International Symposium on EMC, and have
been an instructor the symposium’s “Global EMC
University”. He has also
been an invited speaker at IEEE and SAE conferences held in the United States
and international
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