Current Status and Future
Trends for Si and Compound MMICs in
Millimeter-wave Regime and Related Issues for System on Chip (SOC) and/or
System in Package (SIP) Applications
Huei Wang
Abstract: The
anticipated presentation will cover the current status and future
trends of millimeter-wave MMICs, including those
using III-V compound (GaAs,
InP, GaN, etc.) and
Si-based (CMOS, SiGe HBT and BiCMOS)
MMIC technologies.
Millimeter-wave MMICs used to be applied to military
and astronomy systems for
long time and started to be utilized for civil applications in the decade, such
as communications and automotive radars. The evolution of IC technologies
has
enabled the performance of Si-based MMICs over 100
GHz, even in standard bulk
CMOS processes. This is believed to have a major impact in the future
development of millimeter-wave systems. Since low-cost mass-production
potential pushes forward the technology, a very high integration of circuit
functions on a chip, such as RF, base-band circuitry, automatic-control for a
steady operation, and maybe even the antenna, etc. should be included, and thus
the system on chip (SOC) issues should be addressed, especially in MMW regime.
Moreover, millimeter-wave packaging cost always dominated in the module
development. In order to simplify the assembly and reduced cost, the
concept
of system in package (SIP) has been proposed. This presentation will
also
survey the current technologies for SOC and SIP and discuss related issues and
challenges.
Biography: Huei Wang (S’83-M’87-SM’95-F’06) received the B. S. degree
in electrical
engineering from National Taiwan University in 1980, and the M. S. and Ph. D.
degrees in electrical engineering from Michigan State University in 1984 and
1987, respectively.
During his graduate study, he was engaged in the research on theoretical and
numerical analysis of electromagnetic radiation and scattering problems.
He
was also involved in the development of microwave remote detecting/sensing
systems. Dr. Wang joined Electronic Systems and Technology Division of
TRW
Inc. since 1987. He has been an MTS and Staff Engineer responsible for
MMIC
modeling of CAD tools, MMIC testing evaluation and design and became the Senior
Section Manager of MMW Sensor Product Section in RF Product Center. He
visited
the
MMIC related topics and returned to TRW in 1994. He joined the faculty of
the
Department of Electrical Engineering of National Taiwan University as a
Professor in February 1998. He is currently the Director of Graduate
Institute
of Communication Engineering of National
Dr. Wang is a member of the honor society Phi Kappa Phi and Tau Beta Pi.
He
received the Distinguished Research Award of National Science Council in 2003.
He has been the Richard M. Hong Endowed Chair Professor of
appointed as an IEEE Distinguished Microwave Lecturer for the term of
2007-2009. Dr. Wang received Academic Achievement Award of Ministry of
Education in 2007, and the Distinguished Research Award from
Pan Wen-Yuan’s
Foundation in 2008. of Education of
the National Science Foundation of China.