Fundamentals and Advances in Power Integrity Modeling and Analysis Methods

Speaker : Dr. Ihsan Erdin, Celestica, Ottawa

Topic : Fundamentals and Advances in Power Integrity Modeling and Analysis Methods

Date : Tuesday April 17, 2018

Time : 5:00 PM to 7:00 PM

Location : FIDUS SYSTEMS Inc., 375 Terry Fox Dr. Ottawa, ON, K2K 0J8

Parking : Free

Registration: Free, and is on a first to reply basis. Preference given to IEEE EMC/MTT/AP/CPMT society members. Seating is limited. E-mail Reservation is required. Pizza and soft drinks will be served.

Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter
Office :(613) 595 – 0507 Ext. 377, Cell: (613) 355 – 6632

Dr. Qingsheng Zeng , Chairman of the IEEE Ottawa MTT/AP Chapters


For multicore processors with current loads exceeding 100 A, the power noise is not only a growing electromagnetic interference (EMI) concern, but also a potential logic problem in high-speed printed circuit designs. Depending on the type of application, on-board or on-package local decoupling capacitors are the most commonly used components to mitigate this problem. The board/package real-estate concerns, however, impede the haphazard placement of these components and makes imperative the use of optimization methods for their most effective placement and selection. The computation of power noise in high-speed designs lies at the core of all optimization techniques. For decades, the computation methods that rely on lumped circuit theory have been very popular as quick and dirty analysis tools. At today’s circuit speeds, however, they are too simplistic for accurate results. Numerical electromagnetic analysis tools are arguably the reliable alternatives but they are computationally too intensive for repetitive analysis. Semi-analytic algorithms based on planar circuit theory will be discussed as a balance between these two extreme cases. Accuracy and performance comparison with state-of-the art tools will be provided. The practical implications of these methods will be discussed with application to real-life scenarios. {us}


Ihsan Erdin received the M. Sc. degree from Middle East Tech. U, Ankara, Turkey in 1993 and the Ph.D. degree from Carleton University in 2001, both in electrical engineering. From 1995 to 1996, he was a research fellow at DRDC Ottawa. From 2000 to 2007, he worked as an SI/PI engineer at Nortel in the Passport Project. Since 2007, he has been working in the same job function at Celestica Engineering Design Services in Ottawa. He is an adjunct faculty member with the Electronics Department of Carleton University since 2007. Dr. Erdin is a member of the Professional Engineers Ontario and a senior member of IEEE. He also serves as a member of Signal and Power Integrity Technical Committee (TC-10) of EMC Society. His research interests are analytical methods in electromagnetics as applied to printed and integrated circuit structures.


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